The University of Queensland

Characterization of Solidification and Microstructure of an Al-Zn-Mg-Si Alloy

Tian, He, Qu, Dongdong, Tong, Zherui, Setargew, Nega, Parker, Daniel J., StJohn, David and Nogita, Kazuhiro (2024). Characterization of Solidification and Microstructure of an Al-Zn-Mg-Si Alloy. Corrosion Science and Technology, 23 (2), 104-112. doi: 10.14773/CST.2024.23.2.104

Phase stability of dross particles in hot-dip Zn-55wt%Al-1.6wt%Si galvanizing bath

Qu, Dongdong, Gear, Matthew, Gu, Qinfen, Setargew, Nega, Renshaw, Wayne, McDonald, Stuart, StJohn, David and Nogita, Kazuhiro (2023). Phase stability of dross particles in hot-dip Zn-55wt%Al-1.6wt%Si galvanizing bath. Materials, 16 (3) 1211. doi: 10.3390/ma16031211

Microstructure and electrochemical behavior of a 3D-printed Ti-6Al-4V alloy

Yu, Zhijun, Chen, Zhuo, Qu, Dongdong, Qu, Shoujiang, Wang, Hao, Zhao, Fu, Zhang, Chaoqun, Feng, Aihan and Chen, Daolun (2022). Microstructure and electrochemical behavior of a 3D-printed Ti-6Al-4V alloy. Materials, 15 (13) 4473, 1-15. doi: 10.3390/ma15134473

Electrochemically enhanced Cu6Sn5 anodes with tailored crystal orientation and ordered atomic arrangements for lithium-ion battery applications

Tan, Xin F., Gu, Qinfen, Qu, Dongdong, Yong, Adrian X.B., Yang, Wenhui, McDonald, Stuart D., Matsumura, Syo and Nogita, Kazuhiro (2020). Electrochemically enhanced Cu6Sn5 anodes with tailored crystal orientation and ordered atomic arrangements for lithium-ion battery applications. Acta Materialia, 201, 341-349. doi: 10.1016/j.actamat.2020.10.011

Cuboid-like nanostructure strengthened equiatomic Ti-Zr-Nb-Ta medium entropy alloy

Nguyen, V. T., Qian, M., Shi, Z., Tran, X. Q., Fabijanic, D. M., Joseph, J., Qu, D. D., Matsumura, S., Zhang, C., Zhang, F. and Zou, J. (2020). Cuboid-like nanostructure strengthened equiatomic Ti-Zr-Nb-Ta medium entropy alloy. Materials Science and Engineering A: Structural Materials: Properties, Microstructures and Processing, 798 140169. doi: 10.1016/j.msea.2020.140169

Intermetallic formation mechanisms and properties in room-temperature Ga soldering

Liu, Shiqian, Qu, Dongdong, McDonald, Stuart, Gu, Qinfen, Matsumura, Syo and Nogita, Kazuhiro (2020). Intermetallic formation mechanisms and properties in room-temperature Ga soldering. Journal of Alloys and Compounds, 826 154221, 154221. doi: 10.1016/j.jallcom.2020.154221

On the distribution of the trace elements V and Cr in an Al-Zn-Si alloy coating on a steel substrate

Qu, D.D., Gear, M., Setargew, N., Renshaw, W., McDonald, S., StJohn, D., Paterson, D.J. and Nogita, K. (2020). On the distribution of the trace elements V and Cr in an Al-Zn-Si alloy coating on a steel substrate. Materialia, 11 100669, 100669. doi: 10.1016/j.mtla.2020.100669

Reducing cracking in solder joint interfacial Cu6Sn5 with modified reflow profile

Somidin, Flora, McDonald, Stuart David, Ye, Xiaozhou, Qu, Dongdong, Sweatman, Keith, Akaiwa, Tetsuya, Nishimura, Tetsuro and Nogita, Kazuhiro (2020). Reducing cracking in solder joint interfacial Cu6Sn5 with modified reflow profile. Japan Institute of Electronics Packaging. Transactions, 13, E19-004. doi: 10.5104/jiepeng.13.e19-004-1

Properties of CuGa2 Formed Between Liquid Ga and Cu Substrates at Room Temperature

Liu, Shiqian, McDonald, Stuart, Gu, Qinfen, Matsumura, Syo, Qu, Dongdong, Sweatman, Keith, Nishimura, Tetsuro and Nogita, Kazuhiro (2020). Properties of CuGa2 Formed Between Liquid Ga and Cu Substrates at Room Temperature. Journal of Electronic Materials, 49 (1), 128-139. doi: 10.1007/s11664-019-07688-4

Effect of deposition parameters on microstructure of the Ti-Mg immiscible alloy thin film deposited by multi-arc ion plating

Wei, Xianshun, Dong, Yue, Qu, Dongdong, Ma, Tiancai and Shen, Jun (2019). Effect of deposition parameters on microstructure of the Ti-Mg immiscible alloy thin film deposited by multi-arc ion plating. Metals, 9 (11) 1229, 1229. doi: 10.3390/met9111229

Effects of Ni and Cu antisite substitution on the phase stability of CuGa2 from liquid Ga/Cu–Ni interfacial reaction

Liu, Shiqian, Yang, Wenhui, Kawami, Youichirou, Gu, Qinfen, Matsumura, Syo, Qu, Dongdong, McDonald, Stuart and Nogita, Kazuhiro (2019). Effects of Ni and Cu antisite substitution on the phase stability of CuGa2 from liquid Ga/Cu–Ni interfacial reaction. ACS Applied Materials and Interfaces, 11 (35) acsami.9b10630, 32523-32532. doi: 10.1021/acsami.9b10630

Pressure-induced polyamorphism in lanthanide-solute metallic glasses

Li, Liangliang, Wang, Luhong, Li, Renfeng, Qu, Dongdong, Zhao, Haiyan, Chapman, Karena W. , Chupas, Peter J. and Liu, Haozhe (2017). Pressure-induced polyamorphism in lanthanide-solute metallic glasses. Physica Status Solidi, 11 (6) e201700078, 1700078. doi: 10.1002/pssr.201700078

Constant real-space fractal dimensionality and structure evolution in Ti62Cu38 metallic glass under high pressure

Li, Liangliang, Wang, Luhong, Li, Renfeng, Zhao, Haiyan, Qu, Dongdong, Chapman, Karena W., Chupas, Peter J. and Liu, Haozhe (2016). Constant real-space fractal dimensionality and structure evolution in Ti62Cu38 metallic glass under high pressure. Physical Review B, 94 (18) 184201. doi: 10.1103/PhysRevB.94.184201

A metric to gauge local distortion in metallic glasses and supercooled liquids

Wu, Chen, Karayiannis, Nikos Ch., Laso, Manuel, Qu, Dongdong, Luo, Qiang and Shen, Jun (2014). A metric to gauge local distortion in metallic glasses and supercooled liquids. Acta Materialia, 72, 229-238. doi: 10.1016/j.actamat.2014.03.046

Variability of Poisson's ratio and enhanced ductility in amorphous metal

Liss, Klaus-Dieter, Qu, Dongdong, Yan, Kun and Reid, Mark (2013). Variability of Poisson's ratio and enhanced ductility in amorphous metal. Advanced Engineering Materials, 15 (5), 347-351. doi: 10.1002/adem.201200216

Structural origins for the high plasticity of a Zr-Cu-Ni-Al bulk metallic glass

Qu, D. D., Liss, K. -D., Sun, Y. J., Reid, M., Almer, J. D., Yan, K., Wang, Y. B., Liao, X. Z. and Shen, J. (2013). Structural origins for the high plasticity of a Zr-Cu-Ni-Al bulk metallic glass. Acta Materialia, 61 (1), 321-330. doi: 10.1016/j.actamat.2012.09.062

Undercooling behavior of Zr-Cu-Ni-Al bulk metallic glasses investigated by in situ synchrotron high energy X-ray diffraction

Qu, D. D., Mizuno, A., Watanabe, M., Bednarcik, J. and Shen, J. (2012). Undercooling behavior of Zr-Cu-Ni-Al bulk metallic glasses investigated by in situ synchrotron high energy X-ray diffraction. Materials Science and Engineering A, 555, 36-43. doi: 10.1016/j.msea.2012.06.030

Shear bands in a bulk metallic glass after large plastic deformation

Qu, D. D., Wang, Y. B., Liao, X. Z. and Shen, J. (2012). Shear bands in a bulk metallic glass after large plastic deformation. Scripta Materialia, 67 (4), 332-335. doi: 10.1016/j.scriptamat.2012.05.016

Super-high compressive plastic deformation behaviors of Zr-based metallic glass at room temperature

Wu, F. F., Zheng, W., Deng, J. W., Qu, D. D. and Shen, J. (2012). Super-high compressive plastic deformation behaviors of Zr-based metallic glass at room temperature. Materials Science and Engineering A, 541, 199-203. doi: 10.1016/j.msea.2012.02.025

Introducing a strain-hardening capability to improve the ductility of bulk metallic glasses via severe plastic deformation

Wang, Y. B., Qu, D. D., Wang, X. H., Cao, Y., Liao, X. Z., Kawasaki, M., Ringer, S. P., Shan, Z. W., Langdon, T. G. and Shen, J. (2012). Introducing a strain-hardening capability to improve the ductility of bulk metallic glasses via severe plastic deformation. Acta Materialia, 60 (1), 253-260. doi: 10.1016/j.actamat.2011.09.026

On the atomic anisotropy of thermal expansion in bulk metallic glass

Qu, Dongdong, Liss, Klaus-Dieter, Yan, Kun, Reid, Mark, Almer, Jonathan D., Wang, Yanbo, Liao, Xiaozhou and Shen, Jun (2011). On the atomic anisotropy of thermal expansion in bulk metallic glass. Advanced Engineering Materials, 13 (9), 861-864. doi: 10.1002/adem.201000349

New approaches to the computer simulation of amorphous alloys: a review

Valladares, Ariel A., Diaz-Celaya, Juan A., Galvan-Colin, Jonathan, Mejia-Mendoza, Luis M., Reyes-Retana, Jose A., Valladares, Renela M., Valladares, Alexander, Alvarez-Ramirez, Fernando, Qu, Dongdong and Shen, Jun (2011). New approaches to the computer simulation of amorphous alloys: a review. Materials, 4 (4), 716-781. doi: 10.3390/ma4040716

Inhomogeneous structure and glass-forming ability in Zr-based bulk metallic glasses

Sun, Yong Li, Qu, Dong Dong, Sun, Ya Juan, Liss, K. -D. and Shen, Jun (2010). Inhomogeneous structure and glass-forming ability in Zr-based bulk metallic glasses. Journal of Non-Crystalline Solids, 356 (1), 39-45. doi: 10.1016/j.jnoncrysol.2009.09.021

MECHANICAL PROPERTY OF A NEW Zr-BASED BULK METALLIC GLASS WITH CERTAIN PLASTICITY AT LOW TEMPERATURE

Sun, Yajuan, Qu, Dongdong, Shen, Jun, Huang, Yongjiang and Wei, Xianshun (2009). MECHANICAL PROPERTY OF A NEW Zr-BASED BULK METALLIC GLASS WITH CERTAIN PLASTICITY AT LOW TEMPERATURE. International Journal of Modern Physics B, 23 (6-7), 1331-1336.

Zr-Cu-Ni-Al bulk metallic glasses with superhigh glass-forming ability

Sun, Y. J., Qu, D. D., Huang, Y. J., Liss, K. -D., Wei, X. S., Xing, D. W. and Shen, J. (2009). Zr-Cu-Ni-Al bulk metallic glasses with superhigh glass-forming ability. Acta Materialia, 57 (4), 1290-1299. doi: 10.1016/j.actamat.2008.11.007

Fluidity and microstructural analysis of Al–Ni alloys with varied Ni concentrations

Hari, Vigneshwar, Xu, Dong, McDonald, Stuart D., Tong, Zherui, Qu, Dongdong and Nogita, Kazuhiro (2023). Fluidity and microstructural analysis of Al–Ni alloys with varied Ni concentrations. TMS 2023 Annual Meeting & Exhibition, San Diego, CA, United States, 19-23 March 2023. Cham, Switzerland: Springer Nature Switzerland. doi: 10.1007/978-3-031-22532-1_62

Inhibition of cracking in Cu6Sn5 intermetallic compounds at the interface of lead-free solder joint by controlling the reflow cooling conditions

Somidin, Flora, McDonald, Stuart D., Ye, Xiaozou, Qu, Dongdong, Sweatman, Keith, Akaiwa, Tetsuya, Nishimura, Tetsuro and Nogita, Kazuhiro (2019). Inhibition of cracking in Cu6Sn5 intermetallic compounds at the interface of lead-free solder joint by controlling the reflow cooling conditions. 2019 International Conference on Electronics Packaging (ICEP2019), Niigata, Japan, 17-20 April 2019. NEW YORK: Institute of Electrical and Electronics Engineers (IEEE). doi: 10.23919/ICEP.2019.8733594

Effect of trace elements on the liquid structure of Sn-Cu alloys investigated by high energy X-ray diffraction

Qu, Dong Dong, McDonald, Stuart D., Yasuda, Hideyuki, Ohara, Koji, Kohara, Shinji and Nogita, Kazuhiro (2018). Effect of trace elements on the liquid structure of Sn-Cu alloys investigated by high energy X-ray diffraction. Electronic Packaging Interconnect Technology Symposium, EPITS 2017, Fukuoka, Japan, 1-2 November 2017. Zurich, Switzerland: Trans Tech Publications. doi: 10.4028/www.scientific.net/SSP.273.101

The interaction of Sn-Ga alloys and Au coated Cu substrates

Liu, Shi Qian, Qu, Dong Dong, McDonald, Stuart D. and Nogita, Kazuhiro (2018). The interaction of Sn-Ga alloys and Au coated Cu substrates. 2017 Electronic Packaging Interconnect Technology Symposium (EPITS 2017), Fukuoka, Japan, 1 - 2 November 2017. Pfaffikon, Switzerland: Scientific.Net. doi: 10.4028/www.scientific.net/SSP.273.3

Mechanical property of a new zr-based bulk metallic glass with certain plasticity at low temperature

Sun, Yajuan, Qu, Dongdong, Shen, Jun, Huang, Yongjiang and Wei, Xianshun (2009). Mechanical property of a new zr-based bulk metallic glass with certain plasticity at low temperature. Fifth International Conference on Advanced Materials and Processing (ICAMP-5), Harbin, China, 3–6 September 2008. Singapore: World Scientific Publishing . doi: 10.1142/s0217979209060907