The University of Queensland

In-situ investigation of the time-temperature dependent lattice and microstructure of Sn-Bi alloys

Tan, Xin F., Hao, Qichao, Zhou, Jiye, Gu, Qinfen, McDonald, Stuart D., Sweatman, Keith, Ikeda, Masahiko, Yasuda, Kazuhiro, Bermingham, Michael J. and Nogita, Kazuhiro (2024). In-situ investigation of the time-temperature dependent lattice and microstructure of Sn-Bi alloys. Materialia, 33 101974, 1-12. doi: 10.1016/j.mtla.2023.101974

Investigating the effects of rapid precipitation of Bi in Sn on the shear strength of BGA Sn-Bi alloys

Hao, Qichao, Tan, Xin F., McDonald, Stuart D., Sweatman, Keith, Akaiwa, Tetsuya and Nogita, Kazuhiro (2024). Investigating the effects of rapid precipitation of Bi in Sn on the shear strength of BGA Sn-Bi alloys. Journal of Electronic Materials, 53 (3), 1223-1238. doi: 10.1007/s11664-023-10850-8

Controlling Pore Position during Transient Liquid Phase Bonding for High-temperature Soldering Processes

Razak, N. R. Abdul, Tan, Xin F., McDonald, Stuart D., Bermingham, Michael J., Venezuela, Jeffrey, Nishimura, Tetsuro and Nogita, Kazuhiro (2024). Controlling Pore Position during Transient Liquid Phase Bonding for High-temperature Soldering Processes. Transactions of The Japan Institute of Electronics Packaging, 17, E23-009. doi: 10.5104/jiepeng.17.e23-009-1

The effect of temperature on the electrical resistivity of Sn-Bi alloys

Tan, Xin F., Hao, Qichao, Zhou, Jiye, McDonald, Stuart D., Sweatman, Keith and Nogita, Kazuhiro (2024). The effect of temperature on the electrical resistivity of Sn-Bi alloys. Journal of Electronic Materials, 53 (3), 1183-1191. doi: 10.1007/s11664-023-10849-1

In situ observation of the Ga- and Cu-based substrate reaction by synchrotron microradiography

Hao, Qichao, Tan, Xin Fu, Liu, Shiqian, McDonald, Stuart D., Yasuda, Hideyuki and Nogita, Kazuhiro (2023). In situ observation of the Ga- and Cu-based substrate reaction by synchrotron microradiography. ACS Applied Electronic Materials, 5 (12), 7004-7014. doi: 10.1021/acsaelm.3c01383

The effects of Sb on the lattice and microstructure characteristics of hypo-eutectic Sn-Bi alloys

Tan, Xin F., Hao, Qichao, Gu, Qinfen, McDonald, Stuart D., Sweatman, Keith, Bermingham, Michael and Nogita, Kazuhiro (2023). The effects of Sb on the lattice and microstructure characteristics of hypo-eutectic Sn-Bi alloys. Materials Characterization, 201 112934, 1-11. doi: 10.1016/j.matchar.2023.112934

The temperature-dependent phase transformation and microstructural characterisation in In-Sn solder alloys

Zhou, Jiye, Tan, Xin Fu, Gu, Qinfen, McDonald, Stuart D. and Nogita, Kazuhiro (2023). The temperature-dependent phase transformation and microstructural characterisation in In-Sn solder alloys. JOM, 75 (8), 3149-3161. doi: 10.1007/s11837-023-05870-y

Phase stability of dross particles in hot-dip Zn-55wt%Al-1.6wt%Si galvanizing bath

Qu, Dongdong, Gear, Matthew, Gu, Qinfen, Setargew, Nega, Renshaw, Wayne, McDonald, Stuart, StJohn, David and Nogita, Kazuhiro (2023). Phase stability of dross particles in hot-dip Zn-55wt%Al-1.6wt%Si galvanizing bath. Materials, 16 (3) 1211. doi: 10.3390/ma16031211

Mechanical properties and microstructure of binary In-Sn alloys for flexible low temperature electronic joints

Zhou, Jiye, Tan, Xin Fu, McDonald, Stuart D. and Nogita, Kazuhiro (2022). Mechanical properties and microstructure of binary In-Sn alloys for flexible low temperature electronic joints. Materials, 15 (23) 8321, 1-12. doi: 10.3390/ma15238321

Na-modified cast hypo-eutectic Mg–Mg2Si alloys for solid-state hydrogen storage

Tan, Xin F., Kim, Manjin, Gu, Qinfen, Pinzon Piraquive, Julio, Zeng, Guang, McDonald, Stuart D. and Nogita, Kazuhiro (2022). Na-modified cast hypo-eutectic Mg–Mg2Si alloys for solid-state hydrogen storage. Journal of Power Sources, 538 231538, 231538. doi: 10.1016/j.jpowsour.2022.231538

Controlling the distribution of porosity during transient liquid phase bonding of Sn-based solder joint

Abdul Razak, N. R., Tan, X. F., Mohd Salleh, M. A. A., McDonald, S. D., Bermingham, M. J., Yasuda, H. and Nogita, K. (2022). Controlling the distribution of porosity during transient liquid phase bonding of Sn-based solder joint. Materials Today Communications, 31 103248, 103248. doi: 10.1016/j.mtcomm.2022.103248

Hydrogen sorption behaviour of Mg-5wt.%La alloys after the initial hydrogen absorption process

Kim, Manjin, Tan, Xin Fu, Gu, Qinfen, McDonald, Stuart D., Ali, Yahia, Matsumura, Syo and Nogita, Kazuhiro (2022). Hydrogen sorption behaviour of Mg-5wt.%La alloys after the initial hydrogen absorption process. International Journal of Hydrogen Energy, 47 (36), 16132-16143. doi: 10.1016/j.ijhydene.2022.03.102

Systematic investigation of the effect of Ni concentration in Cu-xNi/Sn couples for high temperature soldering

Tan, Xin F., Gu, Qinfen, Bermingham, Michael, McDonald, Stuart D. and Nogita, Kazuhiro (2022). Systematic investigation of the effect of Ni concentration in Cu-xNi/Sn couples for high temperature soldering. Acta Materialia, 226 117661. doi: 10.1016/j.actamat.2022.117661

The effects of temperature and solute diffusion on volume change in Sn-Bi solder alloys

Hao, Qichao, Tan, Xin F., Gu, Qinfen, Sweatman, Keith, McDonald, Stuart D. and Nogita, Kazuhiro (2022). The effects of temperature and solute diffusion on volume change in Sn-Bi solder alloys. JOM, 74 (4), 1739-1750. doi: 10.1007/s11837-021-05145-4

In situ observation of liquid solder alloys and solid substrate reactions using high-voltage transmission electron microscopy

Tan, Xin F., Somidin, Flora, McDonald, Stuart D., Bermingham, Michael J., Maeno, Hiroshi, Matsumura, Syo and Nogita, Kazuhiro (2022). In situ observation of liquid solder alloys and solid substrate reactions using high-voltage transmission electron microscopy. Materials, 15 (2) 510, 510. doi: 10.3390/ma15020510

Investigation on the solidification and phase transformation in Pb-free solders using in situ synchrotron radiography and diffraction: a review

Zeng, Guang, Liu, Shiqian, Gu, Qinfen, Zheng, Zebang, Yasuda, Hideyuki, McDonald, Stuart D. and Nogita, Kazuhiro (2022). Investigation on the solidification and phase transformation in Pb-free solders using in situ synchrotron radiography and diffraction: a review. Acta Metallurgica Sinica, 35 (1), 49-66. doi: 10.1007/s40195-021-01350-x

Peritectic phase formation kinetics of directionally solidifying Sn-Cu alloys within a broad growth rate regime

Mehreen, Syeda U., Nogita, Kazuhiro, McDonald, Stuart D., Yasuda, Hideyuki and StJohn, David H. (2021). Peritectic phase formation kinetics of directionally solidifying Sn-Cu alloys within a broad growth rate regime. Acta Materialia, 220 117295, 1-11. doi: 10.1016/j.actamat.2021.117295

Rapid fabrication of tin-copper anodes for lithium-ion battery applications

Tan, Xin Fu, Belyakov, Sergey A., Su, Te-Cheng, Gu, Qinfen, Liu, Shiqian, McDonald, Stuart D., Gourlay, Christopher M., Yasuda, Hideyuki, Matsumura, Syo and Nogita, Kazuhiro (2021). Rapid fabrication of tin-copper anodes for lithium-ion battery applications. Journal of Alloys and Compounds, 867 159031, 159031. doi: 10.1016/j.jallcom.2021.159031

Interfacial reactions between Ga and Cu-xNi (x=0, 2, 6, 10, 14) substrates and the strength of Cu-xNi/Ga/Cu-xNi joints

Liu, Shiqian, Tan, Xin Fu, McDonald, Stuart D., Gu, Qinfen, Matsumura, Syo and Nogita, Kazuhiro (2021). Interfacial reactions between Ga and Cu-xNi (x=0, 2, 6, 10, 14) substrates and the strength of Cu-xNi/Ga/Cu-xNi joints. Intermetallics, 133 107168, 1-9. doi: 10.1016/j.intermet.2021.107168

In-situ observation of high-temperature Pb-free electric interconnections by synchrotron microradiography

Abdul Razak, N.R., Tan, X.F., Somidin, F., Yasuda, H., McDonald, S.D. and Nogita, K. (2021). In-situ observation of high-temperature Pb-free electric interconnections by synchrotron microradiography. Materials Letters, 291 129520, 1-4. doi: 10.1016/j.matlet.2021.129520

Effect of Ni, Zn, Au, Sb and In on the suppression of the Cu3Sn phase in Sn-10 wt.%Cu Alloys

Mehreen, Syeda U., Nogita, Kazuhiro, McDonald, Stuart D., Yasuda, Hideyuki and StJohn, David H. (2021). Effect of Ni, Zn, Au, Sb and In on the suppression of the Cu3Sn phase in Sn-10 wt.%Cu Alloys. Journal of Electronic Materials, 50 (3), 881-892. doi: 10.1007/s11664-020-08709-3

A rational interpretation of solidification microstructures in the Mg-rich corner of the Mg–Al–La system

Kim, Manjin, McDonald, Stuart D., Abbott, Trevor B., Easton, Mark A., Ali, Yahia, StJohn, David H. and Nogita, Kazuhiro (2020). A rational interpretation of solidification microstructures in the Mg-rich corner of the Mg–Al–La system. Journal of Alloys and Compounds, 844 156068, 156068. doi: 10.1016/j.jallcom.2020.156068

Electrochemically enhanced Cu6Sn5 anodes with tailored crystal orientation and ordered atomic arrangements for lithium-ion battery applications

Tan, Xin F., Gu, Qinfen, Qu, Dongdong, Yong, Adrian X.B., Yang, Wenhui, McDonald, Stuart D., Matsumura, Syo and Nogita, Kazuhiro (2020). Electrochemically enhanced Cu6Sn5 anodes with tailored crystal orientation and ordered atomic arrangements for lithium-ion battery applications. Acta Materialia, 201, 341-349. doi: 10.1016/j.actamat.2020.10.011

Effect of Na and cooling rate on the activation of Mg-Ni alloys for hydrogen storage

Kim, Manjin, McDonald, Stuart D., Ali, Yahia, Abbott, Trevor and Nogita, Kazuhiro (2020). Effect of Na and cooling rate on the activation of Mg-Ni alloys for hydrogen storage. Journal of Nanoscience and Nanotechnology, 20 (8), 5192-5200. doi: 10.1166/jnn.2020.18529

The effects of trace Sb and Zn additions on Cu6Sn5 lithium-ion battery anodes

Tan, Xin Fu, Yong, Adrian Xiao Bin, Gu, Qinfen, Yang, Wenhui, Aso, Kohei, Matsumura, Syo, McDonald, Stuart D. and Nogita, Kazuhiro (2020). The effects of trace Sb and Zn additions on Cu6Sn5 lithium-ion battery anodes. Journal of Nanoscience and Nanotechnology, 20 (8), 5182-5191. doi: 10.1166/jnn.2020.18538

Intermetallic formation mechanisms and properties in room-temperature Ga soldering

Liu, Shiqian, Qu, Dongdong, McDonald, Stuart, Gu, Qinfen, Matsumura, Syo and Nogita, Kazuhiro (2020). Intermetallic formation mechanisms and properties in room-temperature Ga soldering. Journal of Alloys and Compounds, 826 154221, 154221. doi: 10.1016/j.jallcom.2020.154221

On the distribution of the trace elements V and Cr in an Al-Zn-Si alloy coating on a steel substrate

Qu, D.D., Gear, M., Setargew, N., Renshaw, W., McDonald, S., StJohn, D., Paterson, D.J. and Nogita, K. (2020). On the distribution of the trace elements V and Cr in an Al-Zn-Si alloy coating on a steel substrate. Materialia, 11 100669, 100669. doi: 10.1016/j.mtla.2020.100669

Interfacial reactions between Ga and Cu-10Ni substrate at low temperature

Liu, Shiqian, Zeng, Guang, Yang, Wenhui, McDonald, Stuart, Gu, Qinfen, Matsumura, Syo and Nogita, Kazuhiro (2020). Interfacial reactions between Ga and Cu-10Ni substrate at low temperature. ACS Applied Materials and Interfaces, 12 (18) acsami.0c02032, 21045-21056. doi: 10.1021/acsami.0c02032

Reducing cracking in solder joint interfacial Cu6Sn5 with modified reflow profile

Somidin, Flora, McDonald, Stuart David, Ye, Xiaozhou, Qu, Dongdong, Sweatman, Keith, Akaiwa, Tetsuya, Nishimura, Tetsuro and Nogita, Kazuhiro (2020). Reducing cracking in solder joint interfacial Cu6Sn5 with modified reflow profile. Japan Institute of Electronics Packaging. Transactions, 13, E19-004. doi: 10.5104/jiepeng.13.e19-004-1

Titanium sponge as a source of native nuclei in titanium alloys

Tedman-Jones, S.N., Bermingham, M.J., McDonald, S.D., StJohn, D.H. and Dargusch, M.S. (2020). Titanium sponge as a source of native nuclei in titanium alloys. Journal of Alloys and Compounds, 818 153353, 153353. doi: 10.1016/j.jallcom.2019.153353

Direct observation of the Ni stabilising effect in interfacial (Cu,Ni)6Sn5 intermetallic compounds

Somidin, Flora, Maeno, Hiroshi, Toriyama, Takaaki, McDonald, Stuart D., Yang, Wenhui, Matsumura, Syo and Nogita, Kazuhiro (2020). Direct observation of the Ni stabilising effect in interfacial (Cu,Ni)6Sn5 intermetallic compounds. Materialia, 9 100530, 100530. doi: 10.1016/j.mtla.2019.100530

Properties of CuGa2 Formed Between Liquid Ga and Cu Substrates at Room Temperature

Liu, Shiqian, McDonald, Stuart, Gu, Qinfen, Matsumura, Syo, Qu, Dongdong, Sweatman, Keith, Nishimura, Tetsuro and Nogita, Kazuhiro (2020). Properties of CuGa2 Formed Between Liquid Ga and Cu Substrates at Room Temperature. Journal of Electronic Materials, 49 (1), 128-139. doi: 10.1007/s11664-019-07688-4

Evidence of copper separation in lithiated Cu6Sn5 lithium-ion battery anodes

Tan, Xin F., Yang, Wenhui, Aso, Kohei, Matsumura, Syo, McDonald, Stuart D. and Nogita, Kazuhiro (2019). Evidence of copper separation in lithiated Cu6Sn5 lithium-ion battery anodes. ACS Applied Energy Materials, 3 (1) acsaem.9b02014, 141-145. doi: 10.1021/acsaem.9b02014

The effects of Ni on inhibiting the separation of Cu during the lithiation of Cu6Sn5 lithium-ion battery anodes

Tan, Xin F., McDonald, Stuart D., Gu, Qinfen, Wang, Lianzhou, Matsumura, Syo and Nogita, Kazuhiro (2019). The effects of Ni on inhibiting the separation of Cu during the lithiation of Cu6Sn5 lithium-ion battery anodes. Journal of Power Sources, 440 227085, 227085. doi: 10.1016/j.jpowsour.2019.227085

Effects of Ni and Cu antisite substitution on the phase stability of CuGa2 from liquid Ga/Cu–Ni interfacial reaction

Liu, Shiqian, Yang, Wenhui, Kawami, Youichirou, Gu, Qinfen, Matsumura, Syo, Qu, Dongdong, McDonald, Stuart and Nogita, Kazuhiro (2019). Effects of Ni and Cu antisite substitution on the phase stability of CuGa2 from liquid Ga/Cu–Ni interfacial reaction. ACS Applied Materials and Interfaces, 11 (35) acsami.9b10630, 32523-32532. doi: 10.1021/acsami.9b10630

In situ studies revealing dendrite and eutectic growth during the solidification of Sn-0.7Cu-0.5Ag Pb-free solder alloy

Zeng, G., Callaghan, M. D., McDonald, S. D., Yasuda, H. and Nogita, K. (2019). In situ studies revealing dendrite and eutectic growth during the solidification of Sn-0.7Cu-0.5Ag Pb-free solder alloy. Journal of Alloys and Compounds, 797, 804-810. doi: 10.1016/j.jallcom.2019.04.153

A new approach to nuclei identification and grain refinement in titanium alloys

Tedman-Jones, S. N., McDonald, S. D., Bermingham, M. J., StJohn, D. H. and Dargusch, M. S. (2019). A new approach to nuclei identification and grain refinement in titanium alloys. Journal of Alloys and Compounds, 794, 268-284. doi: 10.1016/j.jallcom.2019.04.224

Solidification path and microstructure evolution of Mg-3Al-14La alloy: implications for the Mg-rich corner of the Mg-Al-La phase diagram

Wong, Charlotte, Nogita, Kazuhiro, Styles, Mark J., Zhu, Suming, Qiu, Dong, McDonald, Stuart D., Gibson, Mark A., Abbott, Trevor B. and Easton, Mark A. (2019). Solidification path and microstructure evolution of Mg-3Al-14La alloy: implications for the Mg-rich corner of the Mg-Al-La phase diagram. Journal of Alloys and Compounds, 784, 527-534. doi: 10.1016/j.jallcom.2019.01.029

Investigating the morphological effects of solute on the β-phase in as-cast titanium alloys

Tedman-Jones, S.N., McDonald, S.D., Bermingham, M.J., St John, D.H. and Dargusch, M.S. (2019). Investigating the morphological effects of solute on the β-phase in as-cast titanium alloys. Journal of Alloys and Compounds, 778, 204-214. doi: 10.1016/j.jallcom.2018.11.063

Characterisation of lithium-ion battery anodes fabricated via in-situ Cu6Sn5 growth on a copper current collector

Tan, Xin Fu, McDonald, Stuart D., Gu, Qinfen, Hu, Yuxiang, Wang, Lianzhou, Matsumura, Syo, Nishimura, Tetsuro and Nogita, Kazuhiro (2019). Characterisation of lithium-ion battery anodes fabricated via in-situ Cu6Sn5 growth on a copper current collector. Journal of Power Sources, 415, 50-61. doi: 10.1016/j.jpowsour.2019.01.034

A new perspective on the nucleation, growth morphology and modification of the silicon phase during the formation of eutectic Al-Si grains

StJohn, David, McDonald, Stuart and Darlapudi, Anilajaram (2019). A new perspective on the nucleation, growth morphology and modification of the silicon phase during the formation of eutectic Al-Si grains. JOM, 71 (1), 391-396. doi: 10.1007/s11837-018-3124-5

Imaging the polymorphic transformation in a single Cu6Sn5 grain in a solder joint

Somidin, Flora, Maeno, Hiroshi, Tran, Xuan, McDonald, Stuart D., Mohd Salleh, Mohd, Matsumura, Syo and Nogita, Kazuhiro (2018). Imaging the polymorphic transformation in a single Cu6Sn5 grain in a solder joint. Materials, 11 (11) 2229, 2229. doi: 10.3390/ma11112229

Suppression of Cu3Sn in the Sn-10Cu peritectic alloy by the addition of Ni

Mehreen, Syeda U., Nogita, Kazuhiro, McDonald, Stuart, Yasuda, Hideyuki and St John, David (2018). Suppression of Cu3Sn in the Sn-10Cu peritectic alloy by the addition of Ni. Journal of Alloys and Compounds, 766, 1003-1013. doi: 10.1016/j.jallcom.2018.06.251

(Al,Mg)3La: a new phase in the Mg-Al-La system

Wong, Charlotte, Styles, Mark J., Zhu, Suming, Qiu, Dong, McDonald, Stuart D., Zhu, Yuman, Gibson, Mark A., Abbott, Trevor B. and Easton, Mark A. (2018). (Al,Mg)3La: a new phase in the Mg-Al-La system. Acta Crystallographica Section B-Structural Science Crystal Engineering and Materials, 74 (4), 370-375. doi: 10.1107/S205252061800834X

Ga-based alloys in microelectronic interconnects: a review

Liu, Shiqian, Sweatman, Keith, McDonald, Stuart and Nogita, Kazuhiro (2018). Ga-based alloys in microelectronic interconnects: a review. Materials, 11 (8) 1384, 1384. doi: 10.3390/ma11081384

The effects of precipitation strengthening and solid solution strengthening on strain rate sensitivity of lead-free solders: review

Liu, Shiqian, McDonald, Stuart, Sweatman, Keith and Nogita, Kazuhiro (2018). The effects of precipitation strengthening and solid solution strengthening on strain rate sensitivity of lead-free solders: review. Microelectronics Reliability, 84, 170-180. doi: 10.1016/j.microrel.2018.03.038

Effect of trace lanthanum hexaboride and boron additions on microstructure, tensile properties and anisotropy of Ti-6Al-4V produced by additive manufacturing

Bermingham, M. J., McDonald, S. D. and Dargusch, M. S. (2018). Effect of trace lanthanum hexaboride and boron additions on microstructure, tensile properties and anisotropy of Ti-6Al-4V produced by additive manufacturing. Materials Science and Engineering A, 719, 1-11. doi: 10.1016/j.msea.2018.02.012

Characterising the polymorphic phase transformation at a localised point on a Cu6Sn5 grain

Somidin, Flora, Maeno, Hiroshi, Mohd Salleh, M. A.A., Tran, Xuan Quy, McDonald, Stuart D., Matsumura, Syo and Nogita, Kazuhiro (2018). Characterising the polymorphic phase transformation at a localised point on a Cu6Sn5 grain. Materials Characterization, 138, 113-119. doi: 10.1016/j.matchar.2018.02.006

Reply to 'Comments on "evidence of the hydrogen release mechanism in bulk MgH2"'

Nogita, Kazuhiro, Tran, Xuan Q., Yamamoto, Tomokazu, Tanaka, Eishi, McDonald, Stuart D., Gourlay, Christopher M., Yasuda, Kazuhiro and Matsumura, Syo (2017). Reply to 'Comments on "evidence of the hydrogen release mechanism in bulk MgH2"'. Scientific Reports, 7 (1) 43720, 1-3. doi: 10.1038/srep43720

Effects of Ni and TiO2 additions in as-reflowed and annealed Sn0.7Cu solders on Cu substrates

Mohd Salleh, M. A. A., McDonald, S. D. and Nogita, K. (2017). Effects of Ni and TiO2 additions in as-reflowed and annealed Sn0.7Cu solders on Cu substrates. Journal of Materials Processing Technology, 242, 235-245. doi: 10.1016/j.jmatprotec.2016.11.031

In-situ investigation of the hydrogen release mechanism in bulk Mg2NiH4

Tran, Xuan Quy, McDonald, Stuart D., Gu, Qinfen, Yamamoto, Tomokazu, Shigematsu, Koji, Aso, Kohei, Tanaka, Eishi, Matsumura, Syo and Nogita, Kazuhiro (2017). In-situ investigation of the hydrogen release mechanism in bulk Mg2NiH4. Journal of Power Sources, 341, 130-138. doi: 10.1016/j.jpowsour.2016.11.105

In situ imaging of microstructure formation in electronic interconnections

Salleh, M. A. A. Mohd, Gourlay, C. M., Xian, J. W., Belyakov, S. A., Yasuda, H., McDonald, S. D. and Nogita, K. (2017). In situ imaging of microstructure formation in electronic interconnections. Scientific Reports, 7 (1) 40010, 40010. doi: 10.1038/srep40010

The influence of ageing on the stabilisation of interfacial (Cu,Ni)6(Sn,Zn)5 and (Cu,Au,Ni)6Sn5 intermetallics in Pb-free Ball Grid Array (BGA) solder joints

Zeng, Guang, McDonald, Stuart D., Mu, Dekui, Terada, Yasuko, Yasuda, Hideyuki, Gu, Qinfen, Salleh, M. A. A. Mohd and Nogita, Kazuhiro (2016). The influence of ageing on the stabilisation of interfacial (Cu,Ni)6(Sn,Zn)5 and (Cu,Au,Ni)6Sn5 intermetallics in Pb-free Ball Grid Array (BGA) solder joints. Journal of Alloys and Compounds, 685, 471-482. doi: 10.1016/j.jallcom.2016.05.263

In situ TEM observations of Cu6Sn5 polymorphic transformations in reaction layers between Sn-0.7Cu solders and Cu substrates

Nogita, K., Mohd Salleh, M. A. A., Tanaka, E., Zeng, G., McDonald, S. D. and Matsumura, S. (2016). In situ TEM observations of Cu6Sn5 polymorphic transformations in reaction layers between Sn-0.7Cu solders and Cu substrates. JOM, 68 (11), 2871-2878. doi: 10.1007/s11837-016-2020-0

Effect of trace Na additions on the hydriding kinetics of hypo-eutectic Mg-Ni alloys

Tran, Xuan Quy, McDonald, Stuart D. , Gu, Qinfen, Tan, Xin Fu and Nogita, Kazuhiro (2016). Effect of trace Na additions on the hydriding kinetics of hypo-eutectic Mg-Ni alloys. International Journal of Hydrogen Energy, 42 (10), 6851-6861. doi: 10.1016/j.ijhydene.2016.12.007

Suppression of Cu6Sn5 in TiO2 reinforced solder joints after multiple reflow cycles

Salleh, M. A. A. Mohd, McDonald, S. D., Gourlay, C. M., Yasuda, H. and Nogita, K. (2016). Suppression of Cu6Sn5 in TiO2 reinforced solder joints after multiple reflow cycles. Materials and Design, 108, 418-428. doi: 10.1016/j.matdes.2016.06.121

Effect of impurity N2 concentration on the hydriding kinetics of Na-doped Mg-Ni alloys

Tran, Xuan Quy, McDonald, Stuart D., Gu, Qinfen, Tan, Xin Fu and Nogita, Kazuhiro (2016). Effect of impurity N2 concentration on the hydriding kinetics of Na-doped Mg-Ni alloys. International Journal of Hydrogen Energy, 42 (1), 366-375. doi: 10.1016/j.ijhydene.2016.08.110

Effect of TiO2 on the formation of primary and interfacial Cu6Sn5 in Sn-0.7wt%Cu and Sn-0.7wt%Cu-0.05wt%Ni solder paste during soldering

Mohd Salleh, M. A A, Said, R. M., Saud, N., Yasuda, H., McDonald, S. D. and Nogita, K. (2016). Effect of TiO2 on the formation of primary and interfacial Cu6Sn5 in Sn-0.7wt%Cu and Sn-0.7wt%Cu-0.05wt%Ni solder paste during soldering. Key Engineering Materials, 700, 161-169. doi: 10.4028/www.scientific.net/KEM.700.161

Effect of trace Na additions on the hydrogen absorption kinetics of Mg2Ni

Tran, Xuan Quy, McDonald, Stuart D., Gu, Qinfen, Matsumura, Syo and Nogita, Kazuhiro (2016). Effect of trace Na additions on the hydrogen absorption kinetics of Mg2Ni. Journal of Materials Research, 31 (9), 1316-1327. doi: 10.1557/jmr.2016.123

Critical properties of Cu6Sn5 in electronic devices: Recent progress and a review

Mu, D.K., McDonald, S.D., Read, J., Huang, H. and Nogita, K. (2016). Critical properties of Cu6Sn5 in electronic devices: Recent progress and a review. Current Opinion in Solid State and Materials Science, 20 (2), 55-76. doi: 10.1016/j.cossms.2015.08.001

The influence of ternary alloying elements on the Al-Si eutectic microstructure and the Si morphology

Darlapudi, A., McDonald, S. D., Terzi, S., Prasad, A., Felberbaum, M. and StJohn, D. H. (2016). The influence of ternary alloying elements on the Al-Si eutectic microstructure and the Si morphology. Journal of Crystal Growth, 433, 63-73. doi: 10.1016/j.jcrysgro.2015.10.002

A real-time synchrotron X-ray study of primary phase nucleation and formation in hypoeutectic Al–Si alloys

Prasad, Arvind, Macdonald, Stuart D., Yasuda, Hideyuki, Nogita, Kazuhiro and StJohn, David (2015). A real-time synchrotron X-ray study of primary phase nucleation and formation in hypoeutectic Al–Si alloys. Journal of Crystal Growth, 430, 122-137. doi: 10.1016/j.jcrysgro.2015.06.024

Effect of Ni on the Formation and Growth of Primary Cu6Sn5 Intermetallics in Sn-0.7 wt.%Cu Solder Pastes on Cu Substrates During the Soldering Process

Mohd Salleh, M.A.A., McDonald, S.D., Gourlay, C.M., Belyakov, S.A., Yasuda, H. and Nogita, K. (2015). Effect of Ni on the Formation and Growth of Primary Cu6Sn5 Intermetallics in Sn-0.7 wt.%Cu Solder Pastes on Cu Substrates During the Soldering Process. Journal of Electronic Materials, 45 (1), 154-163. doi: 10.1007/s11664-015-4121-x

Kinetics of the β → α transformation of tin: role of α-tin nucleation

Zeng, Guang, McDonald, Stuart D., Gu, Qinfen, Matsumura, Syo and Nogita, Kazuhiro (2015). Kinetics of the β → α transformation of tin: role of α-tin nucleation. Crystal Growth and Design, 15 (12), 5767-5773. doi: 10.1021/acs.cgd.5b01069

Development of a microwave sintered TiO2 reinforced Sn-0.7wt%Cu-0.05wt%Ni alloy

Salleh, M. A. A. Mohd, McDonald, S. D., Terada, Y., Yasuda, H. and Nogita, K. (2015). Development of a microwave sintered TiO2 reinforced Sn-0.7wt%Cu-0.05wt%Ni alloy. Materials & Design, 82, 136-147. doi: 10.1016/j.matdes.2015.05.077

The influence of ternary Cu additions on the nucleation of eutectic grains in a hypoeutectic Al-10 wt.%Si alloy

Darlapudi, A., McDonald, S. D. and StJohn, D. H. (2015). The influence of ternary Cu additions on the nucleation of eutectic grains in a hypoeutectic Al-10 wt.%Si alloy. Journal of Alloys and Compounds, 646, 699-705. doi: 10.1016/j.jallcom.2015.05.223

In-situ synchrotron X-ray diffraction investigation of the hydriding and dehydriding properties of a cast Mg-Ni alloy

Tran, X. Q., McDonald, S. D., Gu, Q. F. and Nogita, K. (2015). In-situ synchrotron X-ray diffraction investigation of the hydriding and dehydriding properties of a cast Mg-Ni alloy. Journal of Alloys and Compounds, 636 33418, 249-256. doi: 10.1016/j.jallcom.2015.02.044

Rapid Cu6Sn5 growth at liquid Sn/solid Cu interfaces

Mohd Salleh, M. A. A., McDonald, S. D., Yasuda, H., Sugiyama, A. and Nogita, K. (2015). Rapid Cu6Sn5 growth at liquid Sn/solid Cu interfaces. Scripta Materialia, 100, 17-20. doi: 10.1016/j.scriptamat.2014.11.039

In-situ soldering process technique by synchrotron X-ray imaging

Mohd Salleh, M. A. A., Sugiyama, A., Yasuda, H., McDonald, S. D. and Nogita, Naz (2015). In-situ soldering process technique by synchrotron X-ray imaging. Applied Mechanics and Materials, 754-755, 508-512. doi: 10.4028/www.scientific.net/AMM.754-755.508

Evidence of the hydrogen release mechanism in bulk MgH2

Nogita, Kazuhiro, Tran, Xuan Q., Yamamoto, Tomokazu, Tanaka, Eishi, McDonald, Stuart D., Gourlay, Christopher M., Yasuda, Kazuhiro and Matsumura, Syo (2015). Evidence of the hydrogen release mechanism in bulk MgH2. Scientific Reports, 5 (8450) 43720, 1-5. doi: 10.1038/srep08450

The influence of Ni and Zn additions on microstructure and phase transformations in Sn–0.7Cu/Cu solder joints

Zeng, Guang, McDonald, Stuart D., Gu, Qinfen, Terada, Yasuko, Uesugi, Kentaro, Yasuda, Hideyuki and Nogita, Kazuhiro (2015). The influence of Ni and Zn additions on microstructure and phase transformations in Sn–0.7Cu/Cu solder joints. Acta Materialia, 83, 357-371. doi: 10.1016/j.actamat.2014.10.003

Ni segregation in the interfacial (Cu,Ni)6Sn5 intermetallic layer of Sn-0.7Cu-0.05Ni/Cu ball grid array (BGA) joints

Zeng, Guang, McDonald, Stuart D., Mu, Dekui, Terada, Yasuko, Yasuda, Hideyuki, Gu, Qinfen and Nogita, Kazuhiro (2014). Ni segregation in the interfacial (Cu,Ni)6Sn5 intermetallic layer of Sn-0.7Cu-0.05Ni/Cu ball grid array (BGA) joints. Intermetallics, 54, 20-27. doi: 10.1016/j.intermet.2014.05.004

Kinetics of the polymorphic phase transformation of Cu6Sn5

Zeng, Guang, McDonald, Stuart David, Read, Jonathan J., Gu, Qinfen and Nogita, Kazuhiro (2014). Kinetics of the polymorphic phase transformation of Cu6Sn5. Acta Materialia, 69, 135-148. doi: 10.1016/j.actamat.2014.01.027

Solidification of Sn-0.7Cu-0.15Zn solder: In situ observation

Zeng, Guang, McDonald, Stuart David, Gourlay, Christopher M., Uesugi, Kentaro, Terada, Yasuko, Yasuda, Hideyuki and Nogita, Kazuhiro (2014). Solidification of Sn-0.7Cu-0.15Zn solder: In situ observation. Metallurgical and Materials Transactions A - Physical Metallurgy and Materials Science, 45 (2), 918-926. doi: 10.1007/s11661-013-2008-0

Effects of element addition on the beta->alpha transformation in tin

Zeng, Guang, McDonald, Stuart David, Gu, Qinfen, Sweatman, Keith and Nogita, Kazuhiro (2014). Effects of element addition on the beta->alpha transformation in tin. Philosophical Magazine Letters, 94 (2), 53-62. doi: 10.1080/09500839.2013.860247

Grain refinement for improved lead-free solder joint reliability

Sweatman, K., Nishimura, T., McDonald, S. D., Whitewick, M. and Nogita, K. (2014). Grain refinement for improved lead-free solder joint reliability. SMT Surface Mount Technology Magazine, 29 (1), 30-41.

Phase stability and thermal expansion behavior of Cu6Sn5 intermetallics doped with Zn, Au and In

Zeng, Guang, McDonald, Stuart D., Gu, Qinfen, Suenaga, Shoichi, Zhang, Yong, Chen, Jianghua and Nogita, Kazuhiro (2013). Phase stability and thermal expansion behavior of Cu6Sn5 intermetallics doped with Zn, Au and In. Intermetallics, 43, 85-98. doi: 10.1016/j.intermet.2013.07.012

Real time synchrotron X-ray observations of solidification in hypoeutectic Al-Si alloys

Nogita, Kazuhiro, Yasuda, Hideyuki, Prasad, Arvind, McDonald, Stuart D., Nagira, Tomoya, Nakatsuka, Noriaki, Uesugi, Kentaro and StJohn, David H. (2013). Real time synchrotron X-ray observations of solidification in hypoeutectic Al-Si alloys. Materials Characterization, 85, 134-140. doi: 10.1016/j.matchar.2013.08.015

XRD study of the kinetics of transformations in tin

Nogita, K., Gourlay, C. M., McDonald, S. D., Suenaga, S., Read, J., Zeng, G. and Gu, Q. F. (2013). XRD study of the kinetics of transformations in tin. Philosophical Magazine, 93 (27), 3627-3647. doi: 10.1080/14786435.2013.820381

A comparative study of solder properties of Sn-0.7Cu lead-free solder fabricated via the powder metallurgy and casting methods

Salleh, Mohd Arif Anuar Mohd, Al Bakri, Abdullah Mohd Mustafa, Somidin, Flora, Sandu, Andrei Victor, Saud, Norainiza, Kamaruddin, Hussin, McDonald, Stuart D. and Nogita, Kazuhiro (2013). A comparative study of solder properties of Sn-0.7Cu lead-free solder fabricated via the powder metallurgy and casting methods. Revista De Chimie, 64 (7), 725-728.

Determination of the minimum Ni concentration to prevent the η to η4+1 polymorphic transformation of stoichiometric Cu6Sn5

Wu, Y. Q., McDonald, S. D., Read, J., Huang, H. and Nogita, K. (2013). Determination of the minimum Ni concentration to prevent the η to η4+1 polymorphic transformation of stoichiometric Cu6Sn5. Scripta Materialia, 68 (8), 595-598. doi: 10.1016/j.scriptamat.2012.12.012

Investigating the mechanical properties, creep and crack pattern of Cu6Sn5 and (Cu,Ni)(6)Sn-5 on diverse crystal planes

Mu, D., Huang, H., McDonald, S. D., Read, J. and Nogita, K. (2013). Investigating the mechanical properties, creep and crack pattern of Cu6Sn5 and (Cu,Ni)(6)Sn-5 on diverse crystal planes. Materials Science and Engineering A-Structural Materials Properties Microstructure and Processing, 566, 126-133. doi: 10.1016/j.msea.2012.12.057

Creep and mechanical properties of Cu6Sn5 and (Cu,Ni)(6)Sn-5 at elevated temperatures

Mu, Dekui, Huang, Han, McDonald, Stuart D. and Nogita, Kazuhiro (2013). Creep and mechanical properties of Cu6Sn5 and (Cu,Ni)(6)Sn-5 at elevated temperatures. Journal of Electronic Materials, 42 (2), 304-311. doi: 10.1007/s11664-012-2227-y

Influence of composition on the morphology of primary Cu6Sn5 in Sn-4Cu alloys

McDonald, Stuart, Nogita, Kazuhiro, Read, Jonathan, Ventura, Tina and Nishimura, Tetsuro (2013). Influence of composition on the morphology of primary Cu6Sn5 in Sn-4Cu alloys. Journal of Electronic Materials, 42 (2), 256-262. doi: 10.1007/s11664-012-2222-3

Hydrogen desorption of Mg-Mg2Ni hypo-eutectic alloys in Air, Ar, C02, N2 and H2

Nogita, K., McDonald, S., Duguid, A., Tsubota, M. and Gu, Q. F. (2013). Hydrogen desorption of Mg-Mg2Ni hypo-eutectic alloys in Air, Ar, C02, N2 and H2. Journal of Alloys and Compounds, 580 (SUPPL1), S140-S143. doi: 10.1016/j.jallcom.2013.01.006

Real time synchrotron X-ray imaging for nucleation and growth of Cu6Sn5 in Sn-7Cu-0.05Ni high temperature lead-free solder alloys

Nogita, Kazuhiro, Yasuda, Hideyuki, McDonald, Stuart D. and Uesugi, Kentaro (2013). Real time synchrotron X-ray imaging for nucleation and growth of Cu6Sn5 in Sn-7Cu-0.05Ni high temperature lead-free solder alloys. Advanced Materials Research, 626, 200-204. doi: 10.4028/www.scientific.net/AMR.626.200

A new phase in stoichiometric Cu6Sn5

Wu, Y. Q., Barry, J., Yamamoto, T., Gu, Q. F., McDonald, S. D., Matsumura, S., Huang, H. and Nogita, K. (2012). A new phase in stoichiometric Cu6Sn5. Acta Materialia, 60 (19), 6581-6591. doi: 10.1016/j.actamat.2012.08.024

Effect of Zn, Au, and In on the polymorphic phase transformation in Cu6Sn5 intermetallics

Zeng, Guang, McDonald, Stuart D., Gu, Qinfen and Nogita, Kazuhiro (2012). Effect of Zn, Au, and In on the polymorphic phase transformation in Cu6Sn5 intermetallics. Journal of Materials Research, 27 (20), 2609-2614. doi: 10.1557/jmr.2012.247

Determination of minimum machining depth after heat treatment of ASTM grade 2 titanium alloy

Dobeson, Richard G., McDonald, Stuart D. and Dargusch, Matthew S. (2012). Determination of minimum machining depth after heat treatment of ASTM grade 2 titanium alloy. Advanced Engineering Materials, 14 (7), 473-476. doi: 10.1002/adem.201200106

Development of high-temperature solders: Review

Zeng, Guang, McDonald, Stuart and Nogita, Kazuhiro (2012). Development of high-temperature solders: Review. Microelectronics Reliability, 52 (7), 1306-1322. doi: 10.1016/j.microrel.2012.02.018

Effect of Ni on phase stability and thermal expansion of Cu6-xNixSn5 (X=0, 0.5, 1, 1.5 and 2)

Nogita, K., Mu, D., McDonald, S. D., Read, J. and Wu, Y. Q. (2012). Effect of Ni on phase stability and thermal expansion of Cu6-xNixSn5 (X=0, 0.5, 1, 1.5 and 2). Intermetallics, 26, 78-85. doi: 10.1016/j.intermet.2012.03.047

Kinetics of the eta-eta' transformation in Cu6Sn5

Nogita, K., Gourlay, C. M., McDonald, S. D., Wu, Y. Q., Read, J. and Gu, Q. F. (2011). Kinetics of the eta-eta' transformation in Cu6Sn5. Scripta Materialia, 65 (10), 922-925. doi: 10.1016/j.scriptamat.2011.07.058

Processing considerations for cast Ti–25Nb–3Mo–3Zr–2Sn biomedical alloys

Bermingham, M. J., McDonald, S. D., Buddery, A. J., StJohn, D. H. and Dargusch, M. S. (2011). Processing considerations for cast Ti–25Nb–3Mo–3Zr–2Sn biomedical alloys. Materials Science and Engineering C: Materials for Biological Applications, 31 (7), 1520-1525. doi: 10.1016/j.msec.2011.06.011

The effect of boron on the refinement of microstructure in cast cobalt alloys

Bermingham, Michael J., McDonald, Stuart D., StJohn, David H. and Dargusch, Matthew S. (2011). The effect of boron on the refinement of microstructure in cast cobalt alloys. Journal of Materials Research, 26 (7), 951-956. doi: 10.1557/jmr.2011.21

Effect of thermal exposure on the room temperature tensile properties of Grade 2 titanium

Dobeson, Richard, Petrazoller, Nicolas, Dargusch, Matthew and McDonald, Stuart (2011). Effect of thermal exposure on the room temperature tensile properties of Grade 2 titanium. Materials Science and Engineering A-Structural Materials Properties Microstructure and Processing, 528 (10-11), 3925-3929. doi: 10.1016/j.msea.2011.01.086

The influence of solder composition on the impact strength of lead-free solder ball grid array joints

Tsukamoto, H., Nishimura, T., Suenaga, S., McDonald, S. D., Sweatman, K. W. and Nogita, K. (2011). The influence of solder composition on the impact strength of lead-free solder ball grid array joints. Microelectronics Reliability, 51 (3), 657-667. doi: 10.1016/j.microrel.2010.10.012

Effects of boron on microstructure in cast zirconium alloys

Dargusch, M. S., Bermingham, M. J., McDonald, S. D. and St John, D. H. (2010). Effects of boron on microstructure in cast zirconium alloys. Journal of Materials Research, 25 (9), 1695-1700. doi: 10.1557/JMR.2010.0233

An analytical model for constitutional supercooling-driven grain formation and grain size prediction

Qian, M., Cao, P., Easton, M. A., McDonald, S. D. and St John, D. H. (2010). An analytical model for constitutional supercooling-driven grain formation and grain size prediction. Acta Materialia, 58 (9), 3262-3270. doi: 10.1016/j.actamat.2010.01.052

The effect of aluminium content on the eutectic morphology of high pressure die cast magnesium-aluminium alloys

Dargusch, M. S., Nave, M., McDonald, S. D. and StJohn, D. H. (2010). The effect of aluminium content on the eutectic morphology of high pressure die cast magnesium-aluminium alloys. Journal of Alloys and Compounds, 492 (1-2), L64-L68. doi: 10.1016/j.jallcom.2009.11.199

Titanium as an endogenous grain-refining nucleus

Bermingham, M. J., McDonald, S. D., St John, D. H. and Dargusch, M. S. (2010). Titanium as an endogenous grain-refining nucleus. Philosophical Magazine, 90 (6), 699-715. doi: 10.1080/14786430903236057

The role of trace element segregation in the eutectic modification of hypoeutectic Al-Si alloys

Nogita, K, Yasuda, H, Yoshiya, M, McDonald, SD, Takeuchi, A and Suzuki, Y (2010). The role of trace element segregation in the eutectic modification of hypoeutectic Al-Si alloys. Journal of Alloys and Compounds, 489 (2), 415-420. doi: 10.1016/j.jallcom.2009.09.138

Synchrotron micro-XRF measurements of trace element distributions in BGA type solders and solder joints

Nogita, Kazuhiro, Yasuda, Hideyuki, Gourlay, Christopher M., Suenaga, Shoichi, Tsukamoto, Hideaki, McDonald, Stuart D., Takeuchi, Akihisa, Uesugi, Kentaro and Suzuki, Yoshio (2010). Synchrotron micro-XRF measurements of trace element distributions in BGA type solders and solder joints. Transactions of The Japan Institute of Electronics Packaging, 3 (1), 40-46.

Latest developments in understanding grain refinement of cast titanium

Bermingham, Michael, McDonald, Stuart, Dargusch, Matthew and St John, David (2009). Latest developments in understanding grain refinement of cast titanium. Light Metals Age, 67 (4), 47-49.

Beryllium as a grain refiner in titanium alloys

Bermingham, M. J., McDonald, S. D., StJohn D. H. and Dargusch, M. S. (2009). Beryllium as a grain refiner in titanium alloys. Journal of Alloys and Compounds, 481 (1-2), L20-L23. doi: 10.1016/j.jallcom.2009.03.016

Effects of coolant pressure on chip formation while turning Ti6Al4V alloy

Palanisamy, Suresh, McDonald, Stuart D. and Dargusch, Matthew S. (2009). Effects of coolant pressure on chip formation while turning Ti6Al4V alloy. International Journal of Machine Tools and Manufacture, 49 (9), 739-743. doi: 10.1016/j.ijmachtools.2009.02.010

Segregation and grain refinement in cast titanium alloys

Bermingham, M. J., McDonald, S. D., StJohn, D. H. and Dargusch, M. S. (2009). Segregation and grain refinement in cast titanium alloys. Journal of Materials Research, 24 (4), 1529-1535. doi: 10.1557/JMR.2009.0173

Inhibiting cracking of interfacial Cu6Sn5 by Ni additions to Sn-based Lead-free solders

Nogita, Kazuhiro, McDonald, Stuart D., Tsukamoto, Hideaki, Read, Jonathan, Suenaga, S. and Nishimura, T. (2009). Inhibiting cracking of interfacial Cu6Sn5 by Ni additions to Sn-based Lead-free solders. Transactions of the Japan Institute of Electronics Packaging, 2 (1), 46-54.

Effects of boron on microstructure in cast titanium alloys

Bermingham, M., McDonald, S.D., Nogita, K., St John, D.H. and Dargusch, M.S. (2008). Effects of boron on microstructure in cast titanium alloys. Scripta Materialia, 59 (5), 538-541. doi: 10.1016/j.scriptamat.2008.05.002

The mechanism of grain refinement of titanium by silicon

Bermingham, M., McDonald, S.D., Dargusch, M.S. and St John, D.H. (2008). The mechanism of grain refinement of titanium by silicon. Scripta Materialia, 58 (12), 1050-1053. doi: 10.1016/j.scriptamat.2008.01.041

Modeling of grain refinement: Part I. Effect of the solute titanium for aluminum

Yao, X., McDonald, S. D., Dahle, A. K., Davidson, C. J. and St John, D. H. (2008). Modeling of grain refinement: Part I. Effect of the solute titanium for aluminum. Journal of Materials Research, 23 (5), 1282-1291. doi: 10.1557/JMR.2008.0153

Modeling of grain refinement: Part II. Effect of nucleant particles-TiB2 additions for aluminum

Yao, X., McDonald, S.D., Dahle, A.K., Davidson, C.J. and St John, D.H. (2008). Modeling of grain refinement: Part II. Effect of nucleant particles-TiB2 additions for aluminum. Journal of Materials Research, 23 (5), 1292-1300. doi: 10.1557/JMR.2008.0154

Modeling of grain refinement: Part III. Al-7Si-0.3Mg aluminum alloy

Yao, X., McDonald, S. D., Dahle, A. K., Davidson, C. J. and St John, D. H. (2008). Modeling of grain refinement: Part III. Al-7Si-0.3Mg aluminum alloy. Journal of Materials Research, 23 (5), 1301-1306. doi: 10.1557/JMR.2008.0155

Grain-refinement mechanisms in titanium alloys

Bermingham, M., McDonald, S.D., Dargusch, M.S. and St John, D.H. (2008). Grain-refinement mechanisms in titanium alloys. Journal of Materials Research, 23 (1), 97-104. doi: 10.1557/JMR.2008.0002

A rationale for the acoustic monitoring of surface deformation in Ti6Al4V alloys during machining

Palanisamy, S., Dargusch, M. S., McDonald, S., St John, D. H. and Brandt, M. (2007). A rationale for the acoustic monitoring of surface deformation in Ti6Al4V alloys during machining. Advanced Engineering Materials, 9 (11), 1000-1004. doi: 10.1002/adem.200700117

Microstructure of cast titanium alloys

Bermingham, M., McDonald, S.D., Dargusch, M.S. and St John, D.H. (2007). Microstructure of cast titanium alloys. Materials Forum, 31, 84-89.

A rheological assessment of the effect of trace level Ni additions on the solidification of Sn-0.7Cu

Gourlay, CM, Nogita, K, McDonald, SD, Nishimura, T, Sweatman, K and Dahle, AK (2006). A rheological assessment of the effect of trace level Ni additions on the solidification of Sn-0.7Cu. Scripta Materialia, 54 (9), 1557-1562. doi: 10.1016/j.scriptamat.2006.01.025

Eutectic grain size and strontium concentration in hypoeutectic aluminium-silicon alloys

McDonald, S. D., Nogita, K. and Dahle, A. K. (2006). Eutectic grain size and strontium concentration in hypoeutectic aluminium-silicon alloys. Journal of Alloys and Compounds, 422 (1-2), 184-191. doi: 10.1016/j.jallcom.2005.11.070

Eutectic modification and microstructure development in Al-Si alloys

Dahle, A. K., Nogita, K., McDonald, S. D., Dinnis, C. M. and Lu, L. (2005). Eutectic modification and microstructure development in Al-Si alloys. Materials Science And Engineering A-structural Materials Properties Microstructure And Processing, 413-414 (International Conference on Advances in Solidification Processes), 243-248. doi: 10.1016/j.msea.2005.09.055

Modification of Al-Si alloys

Nogita, K., Schaffer, P. L., McDonald, S. D., Lu, L. and Dahle, A. K. (2005). Modification of Al-Si alloys. Aluminium, 81 (4), 330-335.

Erratum: Eutectic Solidification of Al-Si Alloys (Metallurgical and Materials Transactions A (2003), 34A (2690-2693))

Dahle, A. K., McDonald, S. D. and Nogita, K. (2004). Erratum: Eutectic Solidification of Al-Si Alloys (Metallurgical and Materials Transactions A (2003), 34A (2690-2693)). Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science, 35 A (3)

Aluminium phosphide as a eutectic grain nucleus in hypoeutectic Al-Si alloys

Nogita, K, McDonald, SD, Tsujimoto, K, Yasuda, K and Dahle, AK (2004). Aluminium phosphide as a eutectic grain nucleus in hypoeutectic Al-Si alloys. Journal of Electron Microscopy, 53 (4), 361-369. doi: 10.1093/jmicro/dfh048

Eutectic grains in unmodified and strontium-modified hypoeutectic aluminum-silicon alloys

McDonald, S. D., Dahle, A. K., Taylor, J. A. and St John, D. H. (2004). Eutectic grains in unmodified and strontium-modified hypoeutectic aluminum-silicon alloys. Metallurgical And Materials Transactions A-physical Metallurgy And Materials Science, 35A (6), 1829-1837. doi: 10.1007/s11661-004-0091-y

Eutectic modification of Al-Si alloys with rare earth metals

Nogita, K, McDonald, SD and Dahle, AK (2004). Eutectic modification of Al-Si alloys with rare earth metals. Materials Transactions, 45 (2), 323-326. doi: 10.2320/matertrans.45.323

Eutectic nucleation in Al-Si alloys

McDonald, S. D., Nogita, K. and Dahle, A. K. (2004). Eutectic nucleation in Al-Si alloys. Acta Materialia, 52 (14), 4273-4280. doi: 10.1016/j.actamat.2004.05.043

Eutectic solidification and its role in casting porosity formation

Lu, L, Nogita, K, McDonald, SD and Dahle, AK (2004). Eutectic solidification and its role in casting porosity formation. JOM (A publication of The Minerals, Metals & Materials Society), 56 (11), 52-58. doi: 10.1007/s11837-004-0254-8

Modification of Al-Si alloys

Nogita, K., McDonald, S. D. and Dahle, A. K. (2004). Modification of Al-Si alloys. Materials Forum - Aluminium Alloys Their Physical and Mechanical Properties, 28, 945-950.

Modification-related porosity formation in hypoeutectic aluminum-silicon alloys

McDonald, S. D., Dahle, A. K., Taylor, J. A. and St John, D. H. (2004). Modification-related porosity formation in hypoeutectic aluminum-silicon alloys. Metallurgical and Materials Transactions B-Process Metallurgy and Materials Processing Science, 35 (6), 1097-1106. doi: 10.1007/s11663-004-0065-x

Solidification mechanisms of unmodified and strontium-modified hypereutectic aluminium-silicon alloys

Nogita, K., McDonald, S. D. and Dahle, A. K. (2004). Solidification mechanisms of unmodified and strontium-modified hypereutectic aluminium-silicon alloys. Philosophical Magazine, 84 (17), 1683-1696. doi: 10.1080/14786430310001659803

Effects of boron-strontium interactions on eutectic modification in Al-10 mass%Si alloys

Nogita, K, McDonald, SD and Dahle, AK (2003). Effects of boron-strontium interactions on eutectic modification in Al-10 mass%Si alloys. Materials Transactions, 44 (4), 692-695. doi: 10.2320/matertrans.44.692

Response to Discussion of 'Eutectic modification of Al-Si alloys'

Dahle, A. K., McDonald, S. D. and Nogita, K. (2003). Response to Discussion of 'Eutectic modification of Al-Si alloys'. Metallurgical And Materials Transactions A-Physical Metallurgy And Materials Science, 34A (11), 2690-2693. doi: 10.1007/s11661-003-0031-2

Eutectic nucleation and growth in hypoeutectic Al-SI alloys at different strontium levels

Dahle, A. K., Nogita, K., Zindel, J. W., McDonald, S. D. and Hogan, L. M. (2001). Eutectic nucleation and growth in hypoeutectic Al-SI alloys at different strontium levels. Metallurgical and Materials Transactions A - Physical Metallurgy and Materials Science 35A, 32 (4) 352, 949-960. doi: 10.1007/s11661-001-0352-y

Eutectic solidification mode in sodium modified Al-7 mass %Si-3.5 mass %Cu-0.2 mass %Mg casting alloys

Nogita, K., McDonald, S. D., Zindel, J. W. and Dahle, A. K. (2001). Eutectic solidification mode in sodium modified Al-7 mass %Si-3.5 mass %Cu-0.2 mass %Mg casting alloys. Materials Transactions, 42 (9), 1981-1986. doi: 10.2320/matertrans.42.1981

Mechanisms of eutectic solidification in Al-Si alloys modified with Ba, Ca, Y and Yb

Nogita, K., Knuutinen, A., McDonald, S. D. and Dahle, A. K. (2001). Mechanisms of eutectic solidification in Al-Si alloys modified with Ba, Ca, Y and Yb. Journal of Light Metals, 1 (4), 219-228. doi: 10.1016/S1471-5317(02)00005-6

Microstructural evolution and defect formation in Al-Si-Cu-Mg foundry alloy during solidification

McDonald, S., Dahle, A. K., Taylor, J. A., St John, D. H. and Zindel, J. W. (2001). Microstructural evolution and defect formation in Al-Si-Cu-Mg foundry alloy during solidification. Die Casting Bulletin, 88, 12-19.

Modification of Al-Si alloys with Ba, Ca, Y and Yb

Knuutinen, A., Nogita, K., McDonald, S. D. and Dahle, A. K. (2001). Modification of Al-Si alloys with Ba, Ca, Y and Yb. Journal of Light Metals, 1 (4), 229-240. doi: 10.1016/S1471-5317(02)00004-4

Porosity formation in aluminium alloy A356 modified with Ba, Ca, Y and Yb

Knuutinen, A., Nogita, K., McDonald, S. D. and Dahle, A. K. (2001). Porosity formation in aluminium alloy A356 modified with Ba, Ca, Y and Yb. Journal of Light Metals, 1 (4), 241-249. doi: 10.1016/S1471-5317(02)00006-8

Aluminium alloy castability

Taylor, J. A., Otte, M. O. and Mcdonald, S. D. (1999). Aluminium alloy castability. Materials Australia, 31 (5), 16-18.

In-situ observations of CU₆Sn₅ mophological changes at the liquid SAC305/ solid OSP-Cu interface

Nogita, Kazuhiro, Tan, Xin F., Somidin, Flora, McDonald, Stuart D., Maeno, Hiroshi and Matsumura, Syo (2024). In-situ observations of CU6Sn5 mophological changes at the liquid SAC305/ solid OSP-Cu interface. IEEE. doi: 10.23919/icep61562.2024.10535651

Temperature-Dependent Electrical Resistivity in Sn-Bi Alloys

Tan, Xin F., Hao, Qichao, Zhou, Jiye, McDonald, Stuart D., Sweatman, Keith and Nogita, Kazuhiro (2024). Temperature-Dependent Electrical Resistivity in Sn-Bi Alloys. IEEE. doi: 10.23919/icep61562.2024.10535619

Thermal Stability of Bi in Sn-Cu Based High Strength Pb-Free Solder Alloys

Zhou, Jiye, Tan, Xin F., McDonald, Stuart D., Sweatman, Keith, Akaiwa, Tetsuya and Nogita, Kazuhiro (2024). Thermal Stability of Bi in Sn-Cu Based High Strength Pb-Free Solder Alloys. IEEE. doi: 10.23919/icep61562.2024.10535431

Controlling porosity during transient liquid phase bonding for high-temperature soldering processes

Abdul Razak, Nurul R., Tan, Xin F., McDonald, Stuart D., Bermingham, Michael J., Venezuela, Jeffery, Nishimura, Tetsuro and Nogita, Kazuhiro (2023). Controlling porosity during transient liquid phase bonding for high-temperature soldering processes. 2023 International Conference on Electronics Packaging (ICEP), Kumamoto, Japan, 19-22 April 2023. Piscataway, NJ, United States: IEEE. doi: 10.23919/icep58572.2023.10129722

Evolution of the Sn-Bi solder microstructure vs. temperature – an in- situ scanning electron microscopy study

Tan, Xin F., Zhou, Jiye, McDonald, Stuart D., Ikeda, Masahiko and Nogita, Kazuhiro (2023). Evolution of the Sn-Bi solder microstructure vs. temperature – an in- situ scanning electron microscopy study. International Conference on Electronics Packaging, ICEP 2023, Kumamoto, Japan, 19-22 April 2023. Piscataway, NJ, United States: IEEE. doi: 10.23919/icep58572.2023.10129743

The effects of solution treatment and room temperature ageing on mechanical properties of Sn-37wt%Bi and Sn-57wt%Bi

Ye, Xiaozhou, Tao, Lei, McDonald, Stuart D., Tan, Xin Fu, Sweatman, Keith and Nogita, Kazuhiro (2023). The effects of solution treatment and room temperature ageing on mechanical properties of Sn-37wt%Bi and Sn-57wt%Bi. 2023 International Conference on Electronics Packaging (ICEP), Kumamoto, Japan, 19-22 April 2023. Piscataway, NJ, United States: IEEE. doi: 10.23919/icep58572.2023.10129707

Fluidity and microstructural analysis of Al–Ni alloys with varied Ni concentrations

Hari, Vigneshwar, Xu, Dong, McDonald, Stuart D., Tong, Zherui, Qu, Dongdong and Nogita, Kazuhiro (2023). Fluidity and microstructural analysis of Al–Ni alloys with varied Ni concentrations. TMS 2023 Annual Meeting & Exhibition, San Diego, CA, United States, 19-23 March 2023. Cham, Switzerland: Springer Nature Switzerland. doi: 10.1007/978-3-031-22532-1_62

Effect of Microstructural Refinement and Na Addition on Hydrogenation Kinetics of Cast Mg–Al–La Alloy During the First Hydrogen Absorption Process

Kim, Manjin, McDonald, Stuart D., Ali, Yahia, Abbott, Trevor B. and Nogita, Kazuhiro (2022). Effect of Microstructural Refinement and Na Addition on Hydrogenation Kinetics of Cast Mg–Al–La Alloy During the First Hydrogen Absorption Process. 23rd Magnesium Technology Symposium at the 151st TMS Annual Meeting and Exhibition, Anaheim, CA, United States, 27 February - 3 March 2022. Cham, Switzlerland: Springer International Publishing. doi: 10.1007/978-3-030-92533-8_12

Comparison of the mechanical properties of conventional Pb-free solders and eutectic Sn-Bi solder

Hao, Qichao, Tan, Xin Fu, McDonald, Stuart D., Sweatman, Keith, Nishimura, Takatoshi, Nishimura, Tetsuro and Nogita, Kazuhiro (2022). Comparison of the mechanical properties of conventional Pb-free solders and eutectic Sn-Bi solder. International Conference on Electronics Packaging (ICEP), Sapporo, Japan, 11-14 May 2022. Piscataway, NJ, United States: Institute of Electrical and Electronics Engineers. doi: 10.23919/ICEP55381.2022.9795406

Investigation of the effects of surface finish and reflow conditions on the microstructure and mechanical properties of Sn-based solders

Somidin, Flora, Akaiwa, Tetsuya, McDonald, Stuart D., Nishimura, Tetsuro, Ye, Xiaozhou, Smith, Anthony, Zhou, Jiye and Nogita, Kazuhiro (2022). Investigation of the effects of surface finish and reflow conditions on the microstructure and mechanical properties of Sn-based solders. International Conference on Electronics Packaging (ICEP), Sapporo, Japan, 11-14 May 2022. Piscataway, NJ, United States: Institute of Electrical and Electronics Engineers. doi: 10.23919/ICEP55381.2022.9795417

Maximum fluidity length of commercial solder alloys and the effects of Ni and Co in Sn-0.7wt%Cu solder alloys

Nogita, Kazuhiro, Read, Jonathan, McDonald, Stuart D., Xu, Dong and Nishimura, Tetsuro (2022). Maximum fluidity length of commercial solder alloys and the effects of Ni and Co in Sn-0.7wt%Cu solder alloys. International Conference on Electronics Packaging (ICEP), Sapporo, Japan, 11-14 May 2022. Piscataway, NJ, United States: Institute of Electrical and Electronics Engineers. doi: 10.23919/ICEP55381.2022.9795610

The Independent Effects of Cooling Rate and Na Addition on Hydrogen Storage Properties in Hypo-eutectic Mg Alloys

Kim, Manjin, Ali, Yahia, McDonald, Stuart D., Abbott, Trevor B. and Nogita, Kazuhiro (2020). The Independent Effects of Cooling Rate and Na Addition on Hydrogen Storage Properties in Hypo-eutectic Mg Alloys. 149th TMS Annual Meeting & Exhibition, San Diego, CA, United States, 23-27 February 2020. Cham, Switzerland: Springer. doi: 10.1007/978-3-030-36647-6_43

Effect of Zn addition on Cu3Sn formation in Sn-10Cu alloys

Mehreen, Syeda U., Nogita, Kazuhiro, McDonald, Stuart and Stjohn, David (2019). Effect of Zn addition on Cu3Sn formation in Sn-10Cu alloys. The Electronic Packaging Interconnect Technology Symposium 2019 , Penang, Malaysia, 24–25 November 2019. Institute of Physics Publishing. doi: 10.1088/1757-899X/701/1/012009

Influence of cooling conditions on the interfacial Cu6Sn5 intermetallic compound in Sn-37Pb/Cu solder joints during reflow

Somidin, Flora, McDonald, Stuart, Akaiwa, Tetsuya, Nishimura, Tetsuro and Nogita, Kazuhiro (2019). Influence of cooling conditions on the interfacial Cu6Sn5 intermetallic compound in Sn-37Pb/Cu solder joints during reflow. The Electronic Packaging Interconnect Technology Symposium 2019 , Penang, Malaysia, 24–25 November 2019. Institute of Physics Publishing. doi: 10.1088/1757-899X/701/1/012006

Inhibition of cracking in Cu6Sn5 intermetallic compounds at the interface of lead-free solder joint by controlling the reflow cooling conditions

Somidin, Flora, McDonald, Stuart D., Ye, Xiaozou, Qu, Dongdong, Sweatman, Keith, Akaiwa, Tetsuya, Nishimura, Tetsuro and Nogita, Kazuhiro (2019). Inhibition of cracking in Cu6Sn5 intermetallic compounds at the interface of lead-free solder joint by controlling the reflow cooling conditions. 2019 International Conference on Electronics Packaging (ICEP2019), Niigata, Japan, 17-20 April 2019. NEW YORK: Institute of Electrical and Electronics Engineers (IEEE). doi: 10.23919/ICEP.2019.8733594

Interfacial reactions between different Sn-based lead- free solder alloys and CuNi substrates

Abdul Razak, Nurul Razliana, Tan, Xin Fu, McDonald, Stuart D. and Nogita, Kazuhiro (2019). Interfacial reactions between different Sn-based lead- free solder alloys and CuNi substrates. The Electronic Packaging Interconnect Technology Symposium 2019 , Penang, Malaysia, 24–25 November 2019. Institute of Physics Publishing. doi: 10.1088/1757-899X/701/1/012008

Temperature dependency of the growth rate of (Cu,Ni)6Sn5 on Cu-xNi substrates

Tan, Xin Fu, Abdul Razak, Nurul Razliana, Husain, Muhammad Hafiz, McDonald, Stuart and Nogita, Kazuhiro (2019). Temperature dependency of the growth rate of (Cu,Ni)6Sn5 on Cu-xNi substrates. The Electronic Packaging Interconnect Technology Symposium 2019, Penang, Malaysia, 24–25 November 2019. Institute of Physics Publishing. doi: 10.1088/1757-899X/701/1/012007

Effect of reflow conditions on the intermetallic layer in solder joints

Nogita, K., Somidin, F., Mohd Salleh, M. A.A., Sweatman, K., Nishimura, T., McDonald, S. D., Maeno, H. and Matsumura, S. (2018). Effect of reflow conditions on the intermetallic layer in solder joints. 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference, Kuwana, Mie, Japan, 17 - 21 April 2018. Japan: Institute of Electrical and Electronics Engineers. doi: 10.23919/ICEP.2018.8374678

Effect of trace elements on the liquid structure of Sn-Cu alloys investigated by high energy X-ray diffraction

Qu, Dong Dong, McDonald, Stuart D., Yasuda, Hideyuki, Ohara, Koji, Kohara, Shinji and Nogita, Kazuhiro (2018). Effect of trace elements on the liquid structure of Sn-Cu alloys investigated by high energy X-ray diffraction. Electronic Packaging Interconnect Technology Symposium, EPITS 2017, Fukuoka, Japan, 1-2 November 2017. Zurich, Switzerland: Trans Tech Publications. doi: 10.4028/www.scientific.net/SSP.273.101

Effect of trace phosphorus on the dross formation in tin-copper-nickel wave solder

Xuan, Quy Tran, Mohd Salleh, Mohd Arif Anuar, McDonald, Stuart D. and Nogita, Kazuhiro (2018). Effect of trace phosphorus on the dross formation in tin-copper-nickel wave solder. Electronic Packaging Interconnect Technology Symposium, EPITS 2017, Fukuoka, Japan , 1-2 November 2017 . Zurich, Switzerland : Trans Tech Publications. doi: 10.4028/www.scientific.net/SSP.273.9

Experimental study of the solidification microstructure in the Mg-Rich corner of Mg–Al–Ce system

Wong, Charlotte, Styles, Mark J., Zhu, Suming, Abbott, Trevor, Nogita, Kazuhiro, McDonald, Stuart D., StJohn, David H., Gibson, Mark A. and Easton, Mark A. (2018). Experimental study of the solidification microstructure in the Mg-Rich corner of Mg–Al–Ce system. International Symposium on Magnesium Technology, 2018, Phoenix, AZ, USA, March 11, 2018-March 15, 2018. Springer International Publishing. doi: 10.1007/978-3-319-72332-7_13

Formation of Cu6Sn5/(Cu, Ni)6Sn5intermetallic compounds between Cu3Sn-rich Sn-Cu/Sn-Cu-Ni powdered alloys and molten Sn by transient liquid bonding

Somidin, Flora, McDonald, Stuart and Nogita, Kazuhiro (2018). Formation of Cu6Sn5/(Cu, Ni)6Sn5intermetallic compounds between Cu3Sn-rich Sn-Cu/Sn-Cu-Ni powdered alloys and molten Sn by transient liquid bonding. Electronic Packaging Interconnect Technology Symposium (EPITS 2017), Fukuoka, Japan, 1-2 November 2017. Pfaffikon, Switzerland: Trans Tech Publications. doi: 10.4028/www.scientific.net/SSP.273.14

Grain refinements of Cu6Sn5 in Sn-3wt%Ag-5wt%Cu high temperature solder alloys

Tan, Xin Fu, Mohd Salleh, Mohd Arif Anuar, McDonald, Stuart and Nogita, Kazuhiro (2018). Grain refinements of Cu6Sn5 in Sn-3wt%Ag-5wt%Cu high temperature solder alloys. Electronic Packaging Interconnect Technology Symposium, Fukuoka, Japan, 1-2 November 2017. Trans Tech Publications Ltd. doi: 10.4028/www.scientific.net/SSP.273.20

The challenges associated with the formation of equiaxed grains during additive manufacturing of titanium alloys

StJohn, David H., McDonald, Stuart D., Bermingham, Michael J., Mereddy, Sri, Prasad, Arvind and Dargusch, Matthew (2018). The challenges associated with the formation of equiaxed grains during additive manufacturing of titanium alloys. 4th International Conference on Powder Metallurgy of Titanium, PMTi 2017, Xian, China, 8-10 September 2017. Trans Tech Publications Ltd. doi: 10.4028/www.scientific.net/KEM.770.155

The interaction of Sn-Ga alloys and Au coated Cu substrates

Liu, Shi Qian, Qu, Dong Dong, McDonald, Stuart D. and Nogita, Kazuhiro (2018). The interaction of Sn-Ga alloys and Au coated Cu substrates. 2017 Electronic Packaging Interconnect Technology Symposium (EPITS 2017), Fukuoka, Japan, 1 - 2 November 2017. Pfaffikon, Switzerland: Scientific.Net. doi: 10.4028/www.scientific.net/SSP.273.3

Effects of Bi in Sn-Cu based lead-free solder alloys and interconnects

Nogita, K., Salleh, M. A. A. Mohd, Smith, S., Wu, Y. Q., McDonald, S. D., Ab Razak, A. G., Akaiwa, T. and Nishimura, T. (2017). Effects of Bi in Sn-Cu based lead-free solder alloys and interconnects. 2017 International Conference on Electronics Packaging, ICEP 2017, Tendo, Japan, 19 - 22 April 2017. Piscataway, NJ, United States: Institute of Electrical and Electronics Engineers. doi: 10.23919/ICEP.2017.7939399

Real time X-ray imaging of soldering processes at the SPring-8 synchrotron

Nogita, K., Salleh, M. A. A. Mohd, Zeng, G., McDonald, S. D., Gourlay, C. and Yasuda, H. (2017). Real time X-ray imaging of soldering processes at the SPring-8 synchrotron. International Conference on Electronics Packaging (ICEP), Tendo, Japan, 19-22 April 2017. Piscataway, NJ, United States: Institute of Electrical and Electronics Engineers . doi: 10.23919/ICEP.2017.7939343

Real-time observation of AZ91 solidification by synchrotron radiography

Zeng, G., Nogita, K., Belyakov, S., Xian, J. W., McDonald, S. D., Yang, K. V., Yasuda, H. and Gourlay, C. M. (2017). Real-time observation of AZ91 solidification by synchrotron radiography. Magnesium Technology 2017, San Diego, CA, United States, 26 February - 2 March 2017. Cham, Switzerland: Springer. doi: 10.1007/978-3-319-52392-7_82

Effects of trace phosphorus in Sn-Cu-Ni wave solder dross

Nogita, K., Mohd Salleh, M. A. A., Tran, X. Q., Read, J., Smith, S. and McDonald, S. D. (2016). Effects of trace phosphorus in Sn-Cu-Ni wave solder dross. International Conference on Advanced Materials Engineering and Technology, ICAMET 2015, Kaohsiung, Taiwan, 4-5 December 2015. Pfaffikon, Switzerland: Trans Tech Publications. doi: 10.4028/www.scientific.net/MSF.857.49

Peritectic reactions and phase transformations of Sn-30wt%cu for high temperature Pb-free soldering applications

Smith, S., Zeng, G., Read, J., McDonald, S. D. and Nogita, K. (2016). Peritectic reactions and phase transformations of Sn-30wt%cu for high temperature Pb-free soldering applications. International Conference on Advanced Materials Engineering and Technology, ICAMET 2015, Kaohsiung, Taiwan, 4-5 December 2015. Pfaffikon, Switzerland: Trans Tech Publications. doi: 10.4028/www.scientific.net/MSF.857.58

Suppression of Cu3Sn with Ni in high Cu containing Sn-Cu solder alloys

Nogita, K., Kefford, B., Read, J. and McDonald, S. D. (2016). Suppression of Cu3Sn with Ni in high Cu containing Sn-Cu solder alloys. International Conference on Advanced Materials Engineering and Technology, ICAMET 2015, Kaohsiung, Taiwan, 4-5 December 2015. Pfaffikon, Switzerland: Trans Tech Publications. doi: 10.4028/www.scientific.net/MSF.857.53

The influence of Cu, Mg and Ni on the solidification and microstructure of Al-Si alloys

Darlapudi, A., McDonald, S.D. and St John, D.H. (2016). The influence of Cu, Mg and Ni on the solidification and microstructure of Al-Si alloys. 4th International Conference on Advances in Solidification Processes, ICASP 2014, Windsor, United Kingdom, July 8-11, 2014. Bristol, United Kingdom: Institute of Physics Publishing. doi: 10.1088/1757-899X/117/1/012022

Real-time synchrotron x-ray observations of equiaxed solidification of aluminium alloys and implications for modelling

Prasad, A., Liotti, E., McDonald, S. D., Nogita, K., Yasuda, H., Grant, P. S. and StJohn, D. H. (2015). Real-time synchrotron x-ray observations of equiaxed solidification of aluminium alloys and implications for modelling. 14th International Conference on Modeling of Casting, Welding and Advanced Solidification Processes, Awaji island, Hyogo, Japan, 21-26 June 2015. Bristol, United Kingdom: Institute of Physics Publishing. doi: 10.1088/1757-899X/84/1/012014

The beneficial effect of Zn additions on the microstructure of SnCu and SnCuNi solder joints to Cu substrates

Ng, Wayne, Zeng, Guang, Nishimura, Takatoshi, Sweatman, Keith, McDonald, Stuart D. and Nogita, Kazuhiro (2015). The beneficial effect of Zn additions on the microstructure of SnCu and SnCuNi solder joints to Cu substrates. 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference, Kyoto, Japan, 14-17 April 2015. Japan: IEEE. doi: 10.1109/ICEP-IAAC.2015.7111122

Tin pest in lead-free solders? Fundamental studies on the effect of impurities on phase transformation kinetics

Zeng, Guang, McDonald, Stuart D., Sweatman, Keith and Nogita, Kazuhiro (2014). Tin pest in lead-free solders? Fundamental studies on the effect of impurities on phase transformation kinetics. 2014 International Conference on Electronics Packaging (ICEP 2014), Toyama, Japan, 23-25 April 2014. Piscataway, NJ, United States: IEEE. doi: 10.1109/ICEP.2014.6826677

Crack formation and propagation mechanisms in interfacial Cu6Sn5

Nogita, Kazuhiro, Mu, Dekui, McDonald, Stuart D., Read, Stuart D. and Sweatman, Keith (2013). Crack formation and propagation mechanisms in interfacial Cu6Sn5. ICEP 2013: International Conference on Electronic Packaging 2013, Osaka, Japan, 10-12 April 2013. Osaka, Japan: Japan Institute of Electronics Packaging (JIEP).

Effect of Zn, Au and In on the phase stability and thermal expansion of Cu6Sn5 intermetallics

Zeng, Guang, McDonald, Stuart, Gu, Qinfen and Nogita, Kazuhiro (2013). Effect of Zn, Au and In on the phase stability and thermal expansion of Cu6Sn5 intermetallics. Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XII - TMS 2013 142nd Annual Meeting and Exhibition, San Antonio, United States, 3-7 March 2013.

Grain refinement for improved lead-Free solder joint reliability

Sweatman, K., Mcdonald, S. D., Whitewick, M., Nishimura, T. and Nogita, K. (2013). Grain refinement for improved lead-Free solder joint reliability. IPC APEX EXPO Conference and Exhibition 2013, APEX EXPO 2013, San Diego, United States, 19-21 February 2013. Bannockburn, IL, United States: IPC - Association Connecting Electronics Industries.

Non-metal reinforced lead-free composite solder fabrication methods and its reinforcing effects to the suppression of intermetallic formation: short review

Mohd Salleh, M. A. A., McDonald, Stuart and Nogita, Kazuhiro (2013). Non-metal reinforced lead-free composite solder fabrication methods and its reinforcing effects to the suppression of intermetallic formation: short review. ITMS 2013: 4th International Conference on Information Technology for Manufacturing Systems, Auckland, New Zealand, 27-29 August, 2013. Stafa-Zurich, Switzerland: Trans Tech Publications. doi: 10.4028/www.scientific.net/AMM.421.260

Effect of cooling rate on the intermetallic layer in solder joints

Sweatman, Keith, Nishimura, Tetsuro, McDonald, Stuary D. and Nogita, Kazuhiro (2012). Effect of cooling rate on the intermetallic layer in solder joints. IPC APEX Expo 2012, San Diego, United States, 28 February - 1 March 2012. Bannockburn, IL, United States: IPC - Association Connecting Electronics Industries.

Machining of titanium alloys with and without coolant

Palanisamy, S., Dargusch, M. S., McDonald, S. D. and St John, D. H. (2011). Machining of titanium alloys with and without coolant. 5th International Conference on Light Metals Technology, Lüneburg, Germany, 19-22 July 2011. Zurich, Switzerland: Trans Tech Publications. doi: 10.4028/www.scientific.net/MSF.690.481

Characterisation of hydrogen release behaviour in cast Mg-Ni alloys by synchrotron XRD and XAFS

Nogita, Kazuhiro, Jenke, Marc, Wood, David, Duguid, Andrew and McDonald, Stuart D. (2010). Characterisation of hydrogen release behaviour in cast Mg-Ni alloys by synchrotron XRD and XAFS. 7th Pacific Rim International Conference on Advanced Materials and Processing, Cairns, Australia, 2 - 6 August 2010. Zurich, Switzerland: Trans Tech Publications. doi: 10.4028/www.scientific.net/MSF.654-656.2851

Effect of oxygen on the beta-grain size of cast titanium

Bermingham, Michael J., McDonald, Stuart D., Dargusch, Matthew S. and StJohn, David H. (2010). Effect of oxygen on the beta-grain size of cast titanium. 7th Pacific Rim International Conference on Advanced Materials and Processing, PRICM-7, Cairns, QLD, Australia, 2-6 August 2010. Zurich, Switzerland: Trans Tech Publications. doi: 10.4028/www.scientific.net/MSF.654-656.1472

Tool failure criteria while drilling titanium alloys

Palanisamy, Suresh, Cong, Luo, Verijenko, Viktor, McDonald, Stuart D., Owen, Robert and Dargusch, Matthew S. (2010). Tool failure criteria while drilling titanium alloys. 7th Pacific Rim International Conference on Advanced Materials and Processing, Cairns, Australia, 2 - 6 August 2010. Zurich, Switzerland: Trans Tech Publications. doi: 10.4028/www.scientific.net/MSF.654-656.2531

Trace element distribution in solder joints between Sn-based solders and Cu substrates

Nogita, K., Yasuda, H., Gourlay, C. M., Suenaga, S., Tsukamoto, H., McDonald, S. D., Takeuchi, A., Uesugi, K. and Suzuki, Y. (2010). Trace element distribution in solder joints between Sn-based solders and Cu substrates. International Conference on Electronics Packaging ICEP2010, Sapporo, Hokkaido, Japan, 12-14 May 2010. Tokyo, Japan: Japan Institute of Electronics Packaging (JIEP).

Ball impact behavior of Sn-Cu (-Ni) lead-free solder joints

Tsukamoto, Hideaki, Nishimura, T., Suenaga, S., McDonald, S. D., Read, J. and Nogita, K. (2009). Ball impact behavior of Sn-Cu (-Ni) lead-free solder joints. MA2009: The International Conference and Exhibition on Materials and AustCeram 2009, Gold Coast, QLD, Australia, 1-3 July 2009.

Impact strength of Sn-Cu (-Ni) lead-free solder ball grid arrays placed on Cu substrates

Hideaki Tsukamoto, Nishimura, T., Suenaga, S., McDonald, Stuart, Jonathan Read and Nogita, Kazuhiro (2009). Impact strength of Sn-Cu (-Ni) lead-free solder ball grid arrays placed on Cu substrates. Int. Conf. on Electronics Packaging 2009, Kyoto, Japan, 1-16 April 2009. Japan: Japan Institute of Electronics Packaging.

Inhibition of cracking in Cu6Sn5 intermetallic compounds at Sn-Cu lead-free solders and Cu substrate interfaces

Nogita, K., Suenaga, S., McDonald, S. D., Tsukamoto. H., Read, J. and Nishimura, T. (2009). Inhibition of cracking in Cu6Sn5 intermetallic compounds at Sn-Cu lead-free solders and Cu substrate interfaces. ICEP 2009: International Conference on Electronics Packaging 2009, Kyoto, Japan, 14-16 April, 2009. Kyoto, Japan: Japan Institute of Electronics Packaging.

Latest developments in understanding the grain refinement of cast titanium

Bermingham, Michael, McDonald, Stuart D., St John, David H. and Dargusch, Matthew S. (2009). Latest developments in understanding the grain refinement of cast titanium. 4th International Light Metals Technology Conference (LMT 2009), Gold Coast, Australia, 29 June - 1 July 2009. Stafa-Zurich, Switzerland: Trans Tech Publications. doi: 10.4028/www.scientific.net/MSF.618-619.315

The Effect of Ni on Phase Stability in Cu6Sn5

Nogita, K., Read, J., Tsukamoto, H., McDonald, S. D., Gourlay, C. M. and Nishimura, T. (2009). The Effect of Ni on Phase Stability in Cu6Sn5. Japan Institute of Metals Autumn Meeting 2009, Kyoto, Japan, 15-17 September 2009.

The influence of Ni content on cracking in IMC reaction layers between Sn-Cu-Ni solders and Cu substrates

Nogita, K., Gourlay, C. M., Nishimura, T., Suenaga, S., McDonald, S. D. and Tsukamoto, H. (2009). The influence of Ni content on cracking in IMC reaction layers between Sn-Cu-Ni solders and Cu substrates. TMS 2009, San Francisco, California, USA, 15-19 February 2009.

The influence of solder composition on the impact strength of lead-free solder BGA joints

Tsukamoto, Hideaki, Nogita, Kazuhiro, McDonald, Stuart, Nishimura, Tetsuro, Suenaga, Shoichi and Sweatman, Keith W. (2009). The influence of solder composition on the impact strength of lead-free solder BGA joints. 2009 TMS Annual Meeting & Exhibition, San Francisco, CA, USA, 15 - 19 February 2009. TMS.

Role of Ni in stabilization of intermetallic compounds in Sn-Cu alloys

Nogita, K., Nishimura, T., Suenaga, S., McDonald, S. D., Sweatman, K. and Tsukamoto, H. (2008). Role of Ni in stabilization of intermetallic compounds in Sn-Cu alloys. Japanese Institute of Metals Annual Autumn Meeting 2008, Kumamoto, Japan, 23-25 September 2008.

Unintentional effects of Sr additions in Al-Si foundry alloys

McDonald, Stuart, Dargusch, Matthew, Song, Guangling and StJohn, David (2007). Unintentional effects of Sr additions in Al-Si foundry alloys.

Engineering eutectic solidification in Al-Si Alloys

Dahle, A.K., Nogita, K. and McDonald, S.D. (2007). Engineering eutectic solidification in Al-Si Alloys. Solidification Processing 2007, Sheffield, United Kingdom, 23-25 July 2007. Sheffield, United Kingdom: University of Sheffield.

Machining of titanium alloys with and without coolant

Palanisamy, S., Dargusch, M. S., McDonald, S. D., Dowey, S. J. and Doyle, E. D. (2007). Machining of titanium alloys with and without coolant. 16th International Federation for Heat Treatment and Surface Engineering Congress, , , October 30, 2007-November 2, 2007. International Federation for Heat Treatment and Surface Engineering, IFHTSE.

New approaches to understand modification and nucleation mechanisms of hypoeutectic Al-Si Alloys

Nogita, K., McDonald, S.D. and Dahle, A.K. (2007). New approaches to understand modification and nucleation mechanisms of hypoeutectic Al-Si Alloys. TMS Annual Meeting, Orlando, Florida, USA, February 25 - March 1 2007. United Stated: The Minerals, Metals and Materials Society.

The influence of Process Parameters during Machining of Ti6A14V Alloy

Dargusch, M.S., McDonald, S.D., Palanisamy, S. and St John, D.H. (2007). The influence of Process Parameters during Machining of Ti6A14V Alloy. PRICM 6, Jeju Island, Korea, 5-9 November 2007. Switzerland: Trans Tech Publications.

The influence of process parameters during machining of Ti6Al4V alloy

Palanisamy, S., Dargusch, M. S., McDonald, S. D. and StJohn, D. H. (2007). The influence of process parameters during machining of Ti6Al4V alloy. PRICM 6: The Sixth Pacific Rim International Conference on Advanced materials and Processing, Cheju Island, South Korea, 5-9 November, 2007. Zurich, Switzerland: Trans Tech Publications INC.. doi: 10.4028/www.scientific.net/MSF.561-565.159

Unintentional Effects of Sr Additions in Al-Si Foundry Alloys

McDonald, S.D., Dargusch, M.S., Song, G. and St John, D.H. (2007). Unintentional Effects of Sr Additions in Al-Si Foundry Alloys. TMS Annual Meeting and Exhibition, Orlando, Florida, USA, 25 February to 1 March, 2007. United Stated: TMS (The Minerals, Metals and Materials Society).

Vibration and surface deformation during machining of Ti6Al4V alloys

Palanisamy, S., McDonald, S.D., Dargusch, M.S. and St John, D.H. (2007). Vibration and surface deformation during machining of Ti6Al4V alloys. Light Metals Technology Conference 2007, Canada, 24-26 September, 2007. Canada: Public Works and Government Services Canada.

The role of the eutectic in porosity formation in Al-Si foundry alloys

McDonald, S. D., Lu, L., Nogita, K. and Dahle, A. K. (2005). The role of the eutectic in porosity formation in Al-Si foundry alloys. Shape Casting - The John Campbell Symposium - TMS 2005 Annual Meeting, San Francisco, California, 13-17 February 2005 .

Finding eutectic nuclei in hypoeutectic Al-Si alloys by focused ion beam milling

Nogita, K., McDonald, S. D., Tsujimoto, K., Yasuda, K. and Dahle, A. K. (2004). Finding eutectic nuclei in hypoeutectic Al-Si alloys by focused ion beam milling. Proceedings of Japan Institute of Metals Fall Meeting, Japan, 28-30 September 2004. Japan: Japan Institute of Metals.

Recent progress in understanding eutectic solidification in aluminium-silicon foundry alloys

Nogita, K., McDonald, S. D., Dinnis, C. M., Lu, L. and Dahle, A. K. (2004). Recent progress in understanding eutectic solidification in aluminium-silicon foundry alloys. 2004 TMS Annual Meeting and Exhibition, Charlotte, North Carolina, U.S.A., 14-18 March 2004. Warrendale, PA, U.S.A.: The Minerals, Metals and Materials Society.

Eutectic modification of hypoeutectic Al-Si alloys with rare earth metals

Nogita, K., McDonald, S. and Dahle, A. K. (2003). Eutectic modification of hypoeutectic Al-Si alloys with rare earth metals. Proceedings of Japan Institute of Metals Fall Meeting, Japan, 11-13 October 2003. Japan: Japan Institute of Metals.

Effects of boron on eutectic modification of hypoeutectic Al-Si alloys

Nogita, K., McDonald, S. D. and Dahle, A. K. (2002). Effects of boron on eutectic modification of hypoeutectic Al-Si alloys. 2002 Japan Institute of Metals Fall Meeting, Osaka University, Osaka, Japan, 2-4 November, 2002. Sendai, Japan: Japan Institute of Metals.

Eutectic solidification in hypoeutectic Al-Si alloys and its effect on porosity

Dahle, A. K., McDonald, S. D. and Nogita, K. (2002). Eutectic solidification in hypoeutectic Al-Si alloys and its effect on porosity. The 17th International Conference of Australian Society for Ey, Materials Solutions 2002, Columbus, OH, USA, 7-9 October 2002. Materials Park, OH 44073-0002, USA: ASM International, Member/Customer Service Center.

Eutectic solidification in Sr-modified hypoeutectic Al-Si alloys

McDonald, S., Dahle, A. K., Taylor, J. A. and St John, D. H. (2001). Eutectic solidification in Sr-modified hypoeutectic Al-Si alloys. Biennial Conference of Institute of Materials Engineering Australia, Melbourne, Vic, 23-26 Sept 2001. Melbourne: Institute of Materials Engineering Australia.

Understanding eutectic formation in hypoeutectic Al-Si alloys

Dahle, A. K., Nogita, K., McDonald, S. and Zindel, J. W. (2001). Understanding eutectic formation in hypoeutectic Al-Si alloys. TMS 130th Annual Int. Meeting & Exhibition, New Orleans, USA, 11-15 Feb 2001. USA: TMS.

Controlling porosity-related casting rejects: Understanding the role of iron in Al-Si alloys

Otte, M., McDonald, S., Taylor, J. A., St John, D. H. and Schneider, W. E. (2000). Controlling porosity-related casting rejects: Understanding the role of iron in Al-Si alloys. 103rd AFS Casting Congress, St Louis, MO, USA, 13-16 March 1999. Des Plaines, Illinois, USA: American Foundrymen's Society.

Eutectic solidification and porosity formation in Al-Si alloys: the role of strontium

McDonald, S., Nogita, K., Dahle, A. K., Taylor, J. A. and St John, D. H. (2000). Eutectic solidification and porosity formation in Al-Si alloys: the role of strontium. 104th AFS Casting Congress, Pittsburgh, PA, USA, 8-11 April 2000. Des Plaines, Illinois, USA: American Foundrymen's Society.

Microstructural evolution of an Al-Si-Mg foundry alloy during solidification

McDonald, S. D., Dahle, A. K., Taylor, J. A., St John, D. H. and Zindel, J. W. (2000). Microstructural evolution of an Al-Si-Mg foundry alloy during solidification. Die Casting 2000, Melbourne, Australia, 3 - 6 September, 2000. Melbourne: Australian Die Casting Assocation (ADCA).

Eutectic solidification and porosity formation in unmodified and modified hypoeutectic aluminium-silicon alloys

McDonald, Stuart D. (2002). Eutectic solidification and porosity formation in unmodified and modified hypoeutectic aluminium-silicon alloys. PhD Thesis, School of Engineering, The University of Queensland. doi: 10.14264/262975