The University of Queensland

Nitrate-dependent anaerobic methane oxidation coupled to Fe(III) reduction as a source of ammonium and nitrous oxide

Tan, Xin, Lu, Yang, Nie, Wen-Bo, Evans, Paul, Wang, Xiao-Wei, Dang, Cheng-Cheng, Wang, Xuan, Liu, Bing-Feng, Xing, De-Feng, Ren, Nan-Qi and Xie, Guo-Jun (2024). Nitrate-dependent anaerobic methane oxidation coupled to Fe(III) reduction as a source of ammonium and nitrous oxide. Water Research, 256 121571, 1-11. doi: 10.1016/j.watres.2024.121571

In-situ investigation of the time-temperature dependent lattice and microstructure of Sn-Bi alloys

Tan, Xin F., Hao, Qichao, Zhou, Jiye, Gu, Qinfen, McDonald, Stuart D., Sweatman, Keith, Ikeda, Masahiko, Yasuda, Kazuhiro, Bermingham, Michael J. and Nogita, Kazuhiro (2024). In-situ investigation of the time-temperature dependent lattice and microstructure of Sn-Bi alloys. Materialia, 33 101974, 1-12. doi: 10.1016/j.mtla.2023.101974

Investigating the effects of rapid precipitation of Bi in Sn on the shear strength of BGA Sn-Bi alloys

Hao, Qichao, Tan, Xin F., McDonald, Stuart D., Sweatman, Keith, Akaiwa, Tetsuya and Nogita, Kazuhiro (2024). Investigating the effects of rapid precipitation of Bi in Sn on the shear strength of BGA Sn-Bi alloys. Journal of Electronic Materials, 53 (3), 1223-1238. doi: 10.1007/s11664-023-10850-8

Controlling Pore Position during Transient Liquid Phase Bonding for High-temperature Soldering Processes

Razak, N. R. Abdul, Tan, Xin F., McDonald, Stuart D., Bermingham, Michael J., Venezuela, Jeffrey, Nishimura, Tetsuro and Nogita, Kazuhiro (2024). Controlling Pore Position during Transient Liquid Phase Bonding for High-temperature Soldering Processes. Transactions of The Japan Institute of Electronics Packaging, 17, E23-009. doi: 10.5104/jiepeng.17.e23-009-1

The effect of temperature on the electrical resistivity of Sn-Bi alloys

Tan, Xin F., Hao, Qichao, Zhou, Jiye, McDonald, Stuart D., Sweatman, Keith and Nogita, Kazuhiro (2024). The effect of temperature on the electrical resistivity of Sn-Bi alloys. Journal of Electronic Materials, 53 (3), 1183-1191. doi: 10.1007/s11664-023-10849-1

In situ observation of the Ga- and Cu-based substrate reaction by synchrotron microradiography

Hao, Qichao, Tan, Xin Fu, Liu, Shiqian, McDonald, Stuart D., Yasuda, Hideyuki and Nogita, Kazuhiro (2023). In situ observation of the Ga- and Cu-based substrate reaction by synchrotron microradiography. ACS Applied Electronic Materials, 5 (12), 7004-7014. doi: 10.1021/acsaelm.3c01383

Strategies to enhance hydrogen storage performances in bulk Mg-based hydrides

Tan, Xin F., Kim, Manjin, Yasuda, Kazuhiro and Nogita, Kazuhiro (2023). Strategies to enhance hydrogen storage performances in bulk Mg-based hydrides. Journal of Materials Science and Technology, 153, 139-158. doi: 10.1016/j.jmst.2022.12.054

Hydrogen storage performance and phase transformations in as-cast and extruded Mg-Ni-Gd-Y-Zn-Cu alloys

Yao, Hu, Zeng, Guang, Tan, Xin F., Gu, Qinfen, Nogita, Kazuhiro, Guo, Jing and Li, Qian (2023). Hydrogen storage performance and phase transformations in as-cast and extruded Mg-Ni-Gd-Y-Zn-Cu alloys. Journal of Materials Science and Technology, 151, 162-177. doi: 10.1016/j.jmst.2022.12.015

The effects of Sb on the lattice and microstructure characteristics of hypo-eutectic Sn-Bi alloys

Tan, Xin F., Hao, Qichao, Gu, Qinfen, McDonald, Stuart D., Sweatman, Keith, Bermingham, Michael and Nogita, Kazuhiro (2023). The effects of Sb on the lattice and microstructure characteristics of hypo-eutectic Sn-Bi alloys. Materials Characterization, 201 112934, 1-11. doi: 10.1016/j.matchar.2023.112934

The temperature-dependent phase transformation and microstructural characterisation in In-Sn solder alloys

Zhou, Jiye, Tan, Xin Fu, Gu, Qinfen, McDonald, Stuart D. and Nogita, Kazuhiro (2023). The temperature-dependent phase transformation and microstructural characterisation in In-Sn solder alloys. JOM, 75 (8), 3149-3161. doi: 10.1007/s11837-023-05870-y

Mechanical properties and microstructure of binary In-Sn alloys for flexible low temperature electronic joints

Zhou, Jiye, Tan, Xin Fu, McDonald, Stuart D. and Nogita, Kazuhiro (2022). Mechanical properties and microstructure of binary In-Sn alloys for flexible low temperature electronic joints. Materials, 15 (23) 8321, 1-12. doi: 10.3390/ma15238321

Na-modified cast hypo-eutectic Mg–Mg2Si alloys for solid-state hydrogen storage

Tan, Xin F., Kim, Manjin, Gu, Qinfen, Pinzon Piraquive, Julio, Zeng, Guang, McDonald, Stuart D. and Nogita, Kazuhiro (2022). Na-modified cast hypo-eutectic Mg–Mg2Si alloys for solid-state hydrogen storage. Journal of Power Sources, 538 231538, 231538. doi: 10.1016/j.jpowsour.2022.231538

Controlling the distribution of porosity during transient liquid phase bonding of Sn-based solder joint

Abdul Razak, N. R., Tan, X. F., Mohd Salleh, M. A. A., McDonald, S. D., Bermingham, M. J., Yasuda, H. and Nogita, K. (2022). Controlling the distribution of porosity during transient liquid phase bonding of Sn-based solder joint. Materials Today Communications, 31 103248, 103248. doi: 10.1016/j.mtcomm.2022.103248

Properties of Sn-3 wt%Ag-5 wt%Cu alloys with Cu6Sn5 intermetallics grain refined by Mg

Tan, C. Y., Salleh, M.A.A. Mohd, Tan, X. F., Yasuda, H., Saud, N., Ramli, M. I.I. and Nogita, K. (2022). Properties of Sn-3 wt%Ag-5 wt%Cu alloys with Cu6Sn5 intermetallics grain refined by Mg. Materials Today Communications, 31 103221, 103221. doi: 10.1016/j.mtcomm.2022.103221

Cobalt‐doped Cu6Sn5 lithium‐ion battery anodes with enhanced electrochemical properties

Tan, Xin F., Tao, Shiwei, Ran, Lingbing, Knibbe, Ruth and Nogita, Kazuhiro (2022). Cobalt‐doped Cu6Sn5 lithium‐ion battery anodes with enhanced electrochemical properties. Nano Select, 3 (8), 1264-1276. doi: 10.1002/nano.202200056

Hydrogen sorption behaviour of Mg-5wt.%La alloys after the initial hydrogen absorption process

Kim, Manjin, Tan, Xin Fu, Gu, Qinfen, McDonald, Stuart D., Ali, Yahia, Matsumura, Syo and Nogita, Kazuhiro (2022). Hydrogen sorption behaviour of Mg-5wt.%La alloys after the initial hydrogen absorption process. International Journal of Hydrogen Energy, 47 (36), 16132-16143. doi: 10.1016/j.ijhydene.2022.03.102

Evaluation of silicon effects on abrasion performance, microstructure and crystalline structure of NiHard-4 white cast iron using synchrotron X-ray diffraction

Jokari-Sheshdeh, Maziar, Ali, Yahia, Nué, Charline Le, Gallo, Santiago Corujeira, Tan, Xin Fu, Lin, Weikang and Gates, J.D. (2022). Evaluation of silicon effects on abrasion performance, microstructure and crystalline structure of NiHard-4 white cast iron using synchrotron X-ray diffraction. Materialia, 21 101332, 101332. doi: 10.1016/j.mtla.2022.101332

Systematic investigation of the effect of Ni concentration in Cu-xNi/Sn couples for high temperature soldering

Tan, Xin F., Gu, Qinfen, Bermingham, Michael, McDonald, Stuart D. and Nogita, Kazuhiro (2022). Systematic investigation of the effect of Ni concentration in Cu-xNi/Sn couples for high temperature soldering. Acta Materialia, 226 117661. doi: 10.1016/j.actamat.2022.117661

The effects of temperature and solute diffusion on volume change in Sn-Bi solder alloys

Hao, Qichao, Tan, Xin F., Gu, Qinfen, Sweatman, Keith, McDonald, Stuart D. and Nogita, Kazuhiro (2022). The effects of temperature and solute diffusion on volume change in Sn-Bi solder alloys. JOM, 74 (4), 1739-1750. doi: 10.1007/s11837-021-05145-4

Atomic insights into the ordered solid solutions of Ni and Au in η-Cu6Sn5

Yang, Wenhui, Tran, Xuan Quy, Yamamoto, Tomokazu, Aso, Kohei, Somidin, Flora, Tan, Xin Fu, Kawami, Youichirou, Nogita, Kazuhiro and Matsumura, Syo (2022). Atomic insights into the ordered solid solutions of Ni and Au in η-Cu6Sn5. Acta Materialia, 224 117513, 117513. doi: 10.1016/j.actamat.2021.117513

In situ observation of liquid solder alloys and solid substrate reactions using high-voltage transmission electron microscopy

Tan, Xin F., Somidin, Flora, McDonald, Stuart D., Bermingham, Michael J., Maeno, Hiroshi, Matsumura, Syo and Nogita, Kazuhiro (2022). In situ observation of liquid solder alloys and solid substrate reactions using high-voltage transmission electron microscopy. Materials, 15 (2) 510, 510. doi: 10.3390/ma15020510

Rapid fabrication of tin-copper anodes for lithium-ion battery applications

Tan, Xin Fu, Belyakov, Sergey A., Su, Te-Cheng, Gu, Qinfen, Liu, Shiqian, McDonald, Stuart D., Gourlay, Christopher M., Yasuda, Hideyuki, Matsumura, Syo and Nogita, Kazuhiro (2021). Rapid fabrication of tin-copper anodes for lithium-ion battery applications. Journal of Alloys and Compounds, 867 159031, 159031. doi: 10.1016/j.jallcom.2021.159031

Interfacial reactions between Ga and Cu-xNi (x=0, 2, 6, 10, 14) substrates and the strength of Cu-xNi/Ga/Cu-xNi joints

Liu, Shiqian, Tan, Xin Fu, McDonald, Stuart D., Gu, Qinfen, Matsumura, Syo and Nogita, Kazuhiro (2021). Interfacial reactions between Ga and Cu-xNi (x=0, 2, 6, 10, 14) substrates and the strength of Cu-xNi/Ga/Cu-xNi joints. Intermetallics, 133 107168, 1-9. doi: 10.1016/j.intermet.2021.107168

In-situ observation of high-temperature Pb-free electric interconnections by synchrotron microradiography

Abdul Razak, N.R., Tan, X.F., Somidin, F., Yasuda, H., McDonald, S.D. and Nogita, K. (2021). In-situ observation of high-temperature Pb-free electric interconnections by synchrotron microradiography. Materials Letters, 291 129520, 1-4. doi: 10.1016/j.matlet.2021.129520

Electrochemically enhanced Cu6Sn5 anodes with tailored crystal orientation and ordered atomic arrangements for lithium-ion battery applications

Tan, Xin F., Gu, Qinfen, Qu, Dongdong, Yong, Adrian X.B., Yang, Wenhui, McDonald, Stuart D., Matsumura, Syo and Nogita, Kazuhiro (2020). Electrochemically enhanced Cu6Sn5 anodes with tailored crystal orientation and ordered atomic arrangements for lithium-ion battery applications. Acta Materialia, 201, 341-349. doi: 10.1016/j.actamat.2020.10.011

The effects of trace Sb and Zn additions on Cu6Sn5 lithium-ion battery anodes

Tan, Xin Fu, Yong, Adrian Xiao Bin, Gu, Qinfen, Yang, Wenhui, Aso, Kohei, Matsumura, Syo, McDonald, Stuart D. and Nogita, Kazuhiro (2020). The effects of trace Sb and Zn additions on Cu6Sn5 lithium-ion battery anodes. Journal of Nanoscience and Nanotechnology, 20 (8), 5182-5191. doi: 10.1166/jnn.2020.18538

Evidence of copper separation in lithiated Cu6Sn5 lithium-ion battery anodes

Tan, Xin F., Yang, Wenhui, Aso, Kohei, Matsumura, Syo, McDonald, Stuart D. and Nogita, Kazuhiro (2019). Evidence of copper separation in lithiated Cu6Sn5 lithium-ion battery anodes. ACS Applied Energy Materials, 3 (1) acsaem.9b02014, 141-145. doi: 10.1021/acsaem.9b02014

The effects of Ni on inhibiting the separation of Cu during the lithiation of Cu6Sn5 lithium-ion battery anodes

Tan, Xin F., McDonald, Stuart D., Gu, Qinfen, Wang, Lianzhou, Matsumura, Syo and Nogita, Kazuhiro (2019). The effects of Ni on inhibiting the separation of Cu during the lithiation of Cu6Sn5 lithium-ion battery anodes. Journal of Power Sources, 440 227085, 227085. doi: 10.1016/j.jpowsour.2019.227085

In- situ observation of the continuous phase transition in determining the high thermoelectric performance of polycrystalline Sn0.98Se

Dargusch, Matthew, Shi, Xiao-Lei, Tran, Xuan Quy, Feng, Tianli, Somidin, Flora, Tan, Xin, Liu, Weidi, Jack, Kevin, Venezuela, Jeffrey, Maeno, Hiroshi, Toriyama, Takaaki, Matsumura, Syo, Pantelides, Sokrates T. and Chen, Zhi-Gang (2019). In- situ observation of the continuous phase transition in determining the high thermoelectric performance of polycrystalline Sn0.98Se. Journal of Physical Chemistry Letters, 10 (21), 6512-6517. doi: 10.1021/acs.jpclett.9b02818

Characterisation of lithium-ion battery anodes fabricated via in-situ Cu6Sn5 growth on a copper current collector

Tan, Xin Fu, McDonald, Stuart D., Gu, Qinfen, Hu, Yuxiang, Wang, Lianzhou, Matsumura, Syo, Nishimura, Tetsuro and Nogita, Kazuhiro (2019). Characterisation of lithium-ion battery anodes fabricated via in-situ Cu6Sn5 growth on a copper current collector. Journal of Power Sources, 415, 50-61. doi: 10.1016/j.jpowsour.2019.01.034

In situ techniques for developing robust Li-S batteries

Li, Ming, Amirzadeh, Zhila, De Marco, Roland, Tan, Xin Fu, Whittaker, Andrew, Huang, Xia, Wepf, Roger and Knibbe, Ruth (2018). In situ techniques for developing robust Li-S batteries. Small Methods, 2 (11) 1800133, 1800133. doi: 10.1002/smtd.201800133

Effect of trace Na additions on the hydriding kinetics of hypo-eutectic Mg-Ni alloys

Tran, Xuan Quy, McDonald, Stuart D. , Gu, Qinfen, Tan, Xin Fu and Nogita, Kazuhiro (2016). Effect of trace Na additions on the hydriding kinetics of hypo-eutectic Mg-Ni alloys. International Journal of Hydrogen Energy, 42 (10), 6851-6861. doi: 10.1016/j.ijhydene.2016.12.007

Effect of impurity N2 concentration on the hydriding kinetics of Na-doped Mg-Ni alloys

Tran, Xuan Quy, McDonald, Stuart D., Gu, Qinfen, Tan, Xin Fu and Nogita, Kazuhiro (2016). Effect of impurity N2 concentration on the hydriding kinetics of Na-doped Mg-Ni alloys. International Journal of Hydrogen Energy, 42 (1), 366-375. doi: 10.1016/j.ijhydene.2016.08.110

Systems based on hypo-eutectic Mg-Mg2Ni alloys for medium to large scale hydrogen storage and delivery

Moroz, Stephanie, Tan, Xin Fu, Pierce, Jordan, Greaves, Matthew, Duguid, Andrew, Dumur, Krista and Ng, Jeffrey (2013). Systems based on hypo-eutectic Mg-Mg2Ni alloys for medium to large scale hydrogen storage and delivery. Journal of Alloys and Compounds, 580 (SUPPL1), S329-S332. doi: 10.1016/j.jallcom.2013.03.127

In-situ observations of CU₆Sn₅ mophological changes at the liquid SAC305/ solid OSP-Cu interface

Nogita, Kazuhiro, Tan, Xin F., Somidin, Flora, McDonald, Stuart D., Maeno, Hiroshi and Matsumura, Syo (2024). In-situ observations of CU6Sn5 mophological changes at the liquid SAC305/ solid OSP-Cu interface. IEEE. doi: 10.23919/icep61562.2024.10535651

Temperature-Dependent Electrical Resistivity in Sn-Bi Alloys

Tan, Xin F., Hao, Qichao, Zhou, Jiye, McDonald, Stuart D., Sweatman, Keith and Nogita, Kazuhiro (2024). Temperature-Dependent Electrical Resistivity in Sn-Bi Alloys. IEEE. doi: 10.23919/icep61562.2024.10535619

Thermal Stability of Bi in Sn-Cu Based High Strength Pb-Free Solder Alloys

Zhou, Jiye, Tan, Xin F., McDonald, Stuart D., Sweatman, Keith, Akaiwa, Tetsuya and Nogita, Kazuhiro (2024). Thermal Stability of Bi in Sn-Cu Based High Strength Pb-Free Solder Alloys. IEEE. doi: 10.23919/icep61562.2024.10535431

Controlling porosity during transient liquid phase bonding for high-temperature soldering processes

Abdul Razak, Nurul R., Tan, Xin F., McDonald, Stuart D., Bermingham, Michael J., Venezuela, Jeffery, Nishimura, Tetsuro and Nogita, Kazuhiro (2023). Controlling porosity during transient liquid phase bonding for high-temperature soldering processes. 2023 International Conference on Electronics Packaging (ICEP), Kumamoto, Japan, 19-22 April 2023. Piscataway, NJ, United States: IEEE. doi: 10.23919/icep58572.2023.10129722

Evolution of the Sn-Bi solder microstructure vs. temperature – an in- situ scanning electron microscopy study

Tan, Xin F., Zhou, Jiye, McDonald, Stuart D., Ikeda, Masahiko and Nogita, Kazuhiro (2023). Evolution of the Sn-Bi solder microstructure vs. temperature – an in- situ scanning electron microscopy study. International Conference on Electronics Packaging, ICEP 2023, Kumamoto, Japan, 19-22 April 2023. Piscataway, NJ, United States: IEEE. doi: 10.23919/icep58572.2023.10129743

The effects of solution treatment and room temperature ageing on mechanical properties of Sn-37wt%Bi and Sn-57wt%Bi

Ye, Xiaozhou, Tao, Lei, McDonald, Stuart D., Tan, Xin Fu, Sweatman, Keith and Nogita, Kazuhiro (2023). The effects of solution treatment and room temperature ageing on mechanical properties of Sn-37wt%Bi and Sn-57wt%Bi. 2023 International Conference on Electronics Packaging (ICEP), Kumamoto, Japan, 19-22 April 2023. Piscataway, NJ, United States: IEEE. doi: 10.23919/icep58572.2023.10129707

Comparison of the mechanical properties of conventional Pb-free solders and eutectic Sn-Bi solder

Hao, Qichao, Tan, Xin Fu, McDonald, Stuart D., Sweatman, Keith, Nishimura, Takatoshi, Nishimura, Tetsuro and Nogita, Kazuhiro (2022). Comparison of the mechanical properties of conventional Pb-free solders and eutectic Sn-Bi solder. International Conference on Electronics Packaging (ICEP), Sapporo, Japan, 11-14 May 2022. Piscataway, NJ, United States: Institute of Electrical and Electronics Engineers. doi: 10.23919/ICEP55381.2022.9795406

Interfacial reactions between different Sn-based lead- free solder alloys and CuNi substrates

Abdul Razak, Nurul Razliana, Tan, Xin Fu, McDonald, Stuart D. and Nogita, Kazuhiro (2019). Interfacial reactions between different Sn-based lead- free solder alloys and CuNi substrates. The Electronic Packaging Interconnect Technology Symposium 2019 , Penang, Malaysia, 24–25 November 2019. Institute of Physics Publishing. doi: 10.1088/1757-899X/701/1/012008

Temperature dependency of the growth rate of (Cu,Ni)6Sn5 on Cu-xNi substrates

Tan, Xin Fu, Abdul Razak, Nurul Razliana, Husain, Muhammad Hafiz, McDonald, Stuart and Nogita, Kazuhiro (2019). Temperature dependency of the growth rate of (Cu,Ni)6Sn5 on Cu-xNi substrates. The Electronic Packaging Interconnect Technology Symposium 2019, Penang, Malaysia, 24–25 November 2019. Institute of Physics Publishing. doi: 10.1088/1757-899X/701/1/012007

Grain refinements of Cu6Sn5 in Sn-3wt%Ag-5wt%Cu high temperature solder alloys

Tan, Xin Fu, Mohd Salleh, Mohd Arif Anuar, McDonald, Stuart and Nogita, Kazuhiro (2018). Grain refinements of Cu6Sn5 in Sn-3wt%Ag-5wt%Cu high temperature solder alloys. Electronic Packaging Interconnect Technology Symposium, Fukuoka, Japan, 1-2 November 2017. Trans Tech Publications Ltd. doi: 10.4028/www.scientific.net/SSP.273.20

New manufacturing methods for advanced lithium ion battery anode materials

Tan, Xin Fu (2020). New manufacturing methods for advanced lithium ion battery anode materials. PhD Thesis, School of Mechanical and Mining Engineering, The University of Queensland. doi: 10.14264/57e34a9